[PATCH v3 27/30] ARM: dts: sun8i: h3: use calibration for ths
From: Maxime Ripard <hidden>
Date: 2018-09-06 11:51:19
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linux-devicetree, linux-iio, lkml
On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote:
On 04.09.2018 18:46, Emmanuel Vadot wrote:quoted
quoted
+ /* Data cells */ + thermal_calibration: calib at 234 { + reg = <0x234 0x8>; + };You are declaring 8 bytes of calibration data but to my knowledge it's only 2 bytes per sensor, so 2 bytes for H3. Am I missing something ? Thanks,Emmanuel you are right, it is 2 bytes per Sensor and should be 2 bytes for H3, but the thermal calibration data field is on all chips 64 bit wide - so 8 bytes. So I'm reading here the complete calibration data field.
Having one cell per channel would make more sense I guess. Maxime -- Maxime Ripard, Bootlin Embedded Linux and Kernel engineering https://bootlin.com -------------- next part -------------- A non-text attachment was scrubbed... Name: signature.asc Type: application/pgp-signature Size: 833 bytes Desc: not available URL: <http://lists.infradead.org/pipermail/linux-arm-kernel/attachments/20180906/3ce6d114/attachment.sig>