[PATCH v3 21/30] iio: adc: sun4i-gpadc-iio: add support for H3 thermal sensor
From: Maxime Ripard <hidden>
Date: 2018-09-03 10:20:37
Also in:
linux-devicetree, linux-iio, lkml
On Fri, Aug 31, 2018 at 05:51:41PM +0800, Icenowy Zheng wrote:
Personally I suggest to leave out all SID or calibration related patches here. Currently we seems to be wrongly converting SID to big endian, however, the orgnization of the THS calibration data on H6 shows that it's surely little endian: It consists a temperature value in 1/10 celsuis as unit, and some thermal register readout values, which are the values read out at the given temperature, and every value here (the temperature and the readout) are all half word length. Let the temperature value be AABB, the two readout values be XXYY and ZZWW, the oragnization is: BB AA YY XX WW ZZ ** ** . When converting the SID to big endian, it becomes: XX YY AA BB ** ** ZZ WW , which is non-sense, and not able to do sub-word cell addressing. Maxime, should I drop the LE2BE conversion in SID driver? (I doubt whether it will break compatibility.)
This is exposed to the userspace, so no. Maxime
-- Maxime Ripard, Bootlin Embedded Linux and Kernel engineering https://bootlin.com -------------- next part -------------- A non-text attachment was scrubbed... Name: signature.asc Type: application/pgp-signature Size: 833 bytes Desc: not available URL: <http://lists.infradead.org/pipermail/linux-arm-kernel/attachments/20180903/41fb7bfa/attachment.sig>