Thread (83 messages) 83 messages, 9 authors, 2019-02-25

Re: [linux-sunxi] Re: [PATCH v3 27/30] ARM: dts: sun8i: h3: use calibration for ths

From: Philipp Rossak <hidden>
Date: 2018-09-06 12:18:53
Also in: linux-arm-kernel, linux-iio, lkml


On 06.09.2018 14:04, Icenowy Zheng wrote:

于 2018年9月6日 GMT+08:00 下午7:51:15, Maxime Ripard [off-list ref] 写到:
quoted
On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote:
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On 04.09.2018 18:46, Emmanuel Vadot wrote:
quoted
quoted
+			/* Data cells */
+			thermal_calibration: calib@234 {
+				reg = <0x234 0x8>;
+			};
   You are declaring 8 bytes of calibration data but to my knowledge
it's
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quoted
only 2 bytes per sensor, so 2 bytes for H3.
   Am I missing something ?

   Thanks,
Emmanuel you are right, it is 2 bytes per Sensor and should be 2
bytes for
quoted
H3, but the thermal calibration data field is on all chips 64 bit
wide - so
quoted
8 bytes. So I'm reading here the complete calibration data field.
Having one cell per channel would make more sense I guess.
Ok I will change this.
I have mentioned that this is impossible because of wrong
addressing caused by LE2BE in SID driver.
I know! But I would like to prepare patches for it, that they can be 
merged when this is fixed.

Philipp
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