Re: [linux-sunxi] Re: [PATCH v3 27/30] ARM: dts: sun8i: h3: use calibration for ths
From: Philipp Rossak <hidden>
Date: 2018-09-06 12:18:53
Also in:
linux-arm-kernel, linux-iio, lkml
From: Philipp Rossak <hidden>
Date: 2018-09-06 12:18:53
Also in:
linux-arm-kernel, linux-iio, lkml
On 06.09.2018 14:04, Icenowy Zheng wrote:
于 2018年9月6日 GMT+08:00 下午7:51:15, Maxime Ripard [off-list ref] 写到:quoted
On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote:quoted
On 04.09.2018 18:46, Emmanuel Vadot wrote:quoted
quoted
+ /* Data cells */ + thermal_calibration: calib@234 { + reg = <0x234 0x8>; + };You are declaring 8 bytes of calibration data but to my knowledgeit'squoted
quoted
only 2 bytes per sensor, so 2 bytes for H3. Am I missing something ? Thanks,Emmanuel you are right, it is 2 bytes per Sensor and should be 2bytes forquoted
H3, but the thermal calibration data field is on all chips 64 bitwide - soquoted
8 bytes. So I'm reading here the complete calibration data field.Having one cell per channel would make more sense I guess.
Ok I will change this.
I have mentioned that this is impossible because of wrong addressing caused by LE2BE in SID driver.
I know! But I would like to prepare patches for it, that they can be merged when this is fixed. Philipp