Re: [PATCH 2/3] dt-bindings: usb: Introduce samsung,snps-dwc3

On 9/7/2026 12:37 PM, Krzysztof Kozlowski wrote:

On 07/09/2026 08:04, Selvarasu Ganesan wrote:

quoted

On 9/5/2026 12:52 PM, Krzysztof Kozlowski wrote:

quoted

On 03/09/2026 09:12, Selvarasu Ganesan wrote:

quoted

The Samsung Exynos8855 USB glue is not separate from the Synopsys DWC3
core, using a flattened model where the DWC3 controller is directly
addressable rather than nested as a child node of a glue layer.

Describe the Exynos USB block as a single node, referencing the split
out Synopsys DWC3 core properties via snps,dwc3-common.yaml. The new
binding follows the same approach as qcom,snps-dwc3.

A generic fallback compatible "samsung,snps-dwc3" is introduced to
describe this binding, selected by the validator based on the presence
of the fallback string in the compatible list. Future Exynos SoCs

This is AI slop text. Over longish useless sentence describing diff
without actual information WHY.

Don't send AI generated slop messages.

Sorry for the misleading info on this commit message. We were trying to
explain why a separate flattened representation is being introduced with
using generic fallback string, and follow the style of some other DWC3
flattened refactors (like the Qualcomm :
https://lore.kernel.org/all/20250414-dwc3-refactor-v7-2-f015b358722d@oss.qualcomm.com (local))
to justify the separate binding, but it became too long. We'll simplify
it and keep only the technical reasoning.

Flattened node is the right approach, so just say this is the first
Samsung Exynos binding using flattened node.

Thanks for your update.
We will update the commit message as follows and post a new patch set.
And We are assuming that all other points including the clock count and 
the generic fallback compatible (samsung,snps-dwc3) are fine.


dt-bindings: usb: Introduce samsung,snps-dwc3

Add the Samsung Exynos8855 DWC3 binding using a flattened node
representation, where the DWC3 controller is directly
addressable rather than nested as a child node of a glue layer.

This is the first Samsung Exynos binding using the flattened
representation. The existing samsung,exynos-dwc3 binding describes the
parent and child representation used by existing Exynos SoCs, which can
be migrated to the flattened model.

Use the samsung,snps-dwc3 fallback compatible for Samsung Exynos SoCs
sharing the same flattened model can be added by extending the
compatible enum with per SoC clock and property constraints.

Thanks,
Selva

Best regards,
Krzysztof