Re: [PATCH 2/3] dt-bindings: usb: Introduce samsung,snps-dwc3

On 07/09/2026 08:04, Selvarasu Ganesan wrote:

On 9/5/2026 12:52 PM, Krzysztof Kozlowski wrote:

quoted

On 03/09/2026 09:12, Selvarasu Ganesan wrote:

quoted

The Samsung Exynos8855 USB glue is not separate from the Synopsys DWC3
core, using a flattened model where the DWC3 controller is directly
addressable rather than nested as a child node of a glue layer.

Describe the Exynos USB block as a single node, referencing the split
out Synopsys DWC3 core properties via snps,dwc3-common.yaml. The new
binding follows the same approach as qcom,snps-dwc3.

A generic fallback compatible "samsung,snps-dwc3" is introduced to
describe this binding, selected by the validator based on the presence
of the fallback string in the compatible list. Future Exynos SoCs

This is AI slop text. Over longish useless sentence describing diff
without actual information WHY.

Don't send AI generated slop messages.

Sorry for the misleading info on this commit message. We were trying to 
explain why a separate flattened representation is being introduced with 
using generic fallback string, and follow the style of some other DWC3 
flattened refactors (like the Qualcomm : 
https://lore.kernel.org/all/20250414-dwc3-refactor-v7-2-f015b358722d@oss.qualcomm.com (local)) 
to justify the separate binding, but it became too long. We'll simplify 
it and keep only the technical reasoning.

Flattened node is the right approach, so just say this is the first
Samsung Exynos binding using flattened node.


Best regards,
Krzysztof