Re: [PATCH v6 00/18] thermal: exynos: Thermal code rework to use device tree

Hi Kukjin,

Lukasz Majewski wrote:

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Hi Kukjin, Eduardo

Hi,

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On 01/25/15 06:49, Eduardo Valentin wrote:

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On Fri, Jan 23, 2015 at 01:09:53PM +0100, Lukasz Majewski wrote:

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1. Introduction

Following patches aim to clean up the current implementation of
the thermal framework on Exynos devices.

The main goal was to use a generic code for reading thermal
configuration (of-thermal.c). Due to that redundant
exynos_thermal_common.[h|c] files were removed.

Around 400 lines of code (LOC) were removed directly by this
patch, which is around 20% of the Exynos thermal code base.

This work should NOT bring any functional changes to Exynos
thermal subsystem.

2. Patch-set structure

Then the cpu_cooling functionality has been preserved to allow
cooling devices by reducing operating frequency. Definition of
trip points and cpufreq's cooling properties were moved to
device tree.

Then the rework of the way in which configuration data is
provided to the Exynos thermal subsystem was performed. Now
device tree is used for configuration.

3. Dead code removal

Thermal support for some SoCs, previously available in the
exynos_tmu_data.c file, was removed since, as of (almost)
3.19-rc3, they didn't have TMU bindings.

Moreover, support for cpu_cooling devices was preserved only on
those SoCs which had available and working cpufreq driver.

4. Testing

Test devices:
- Exynos4210 - Trats (TMU zone + cpu_cooling)
- Exynos4412 - Trats2/Odroid U3 (TMU zone + cpu_cooling)
- Exynos5250 - Arndale (TMU zone + cpu_cooling)
- Exynos5420 - Arndale-octa (only TMU zones)

Unfortunately, I don't posses Exynos5440 for testing. Its
functionality has been preserved in the code, but not tested on
the hardware. I would be grateful for help in testing.


5. This work apply on the following tree:

kernel.org: 'linux-soc-thermal/next' - Eduardo Velentin's tree
SHA1: 1813d80874699145f04af6b05ebab0a6419001fb


Lukasz Majewski (18):

I have applied the following patches to my -fixes branch (for
next rc cycle)

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  thermal: exynos: cosmetic: Correct comment format
  thermal: exynos: Provide thermal_exynos.h file to be
included in device tree files
  thermal: exynos: Modify exynos thermal code to use device
tree for cpu cooling configuration
  cpufreq: exynos: Use device tree to determine if cpufreq
cooling should be registered
  dts: Documentation: Extending documentation entry for
exynos-thermal dts: Documentation: Update exynos-thermal.txt
example for Exynos5440 thermal: samsung: core: Exynos TMU
rework to use device tree for configuration
  thermal: exynos: Remove exynos_thermal_common.[c|h] files
  thermal: exynos: Remove exynos_tmu_data.c file

The patches below should go via platform tree:

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  arm: dts: trats: Enable TMU on the Exynos4210 trats device
  arm: dts: odroid: Add LDO10 regulator node necessary for TMU
on Odroid arm: dts: odroid: Enable TMU at Exynos4412 based
Odroid U3 device arm: dts: Adding CPU cooling binding for
Exynos SoCs thermal: exynos: dts: Add default definition of
the TMU sensor parameter
  thermal: dts: Default trip points definition for Exynos5420
SoCs thermal: exynos: dts: Define default thermal-zones for
Exynos4 thermal: dts: exynos: Trip points and sensor
configuration data for Exynos5440
  thermal: exynos: dts: Provide device tree bindings identical
to the one in exynos_tmu_data.c

I've applied above patches with small subject changes.

BTW unfortunately, since missing the
"include/dt-bindings/thermal/thermal_exynos.h" in my tree, I
couldn't merge it into for-next yet.

As of this writing: (Kernel 4.0-rc1) the
"include/dt-bindings/thermal/thermal_exynos.h" file is in the kernel
tree.

I know.

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Kukjin, could you add missing DTS files and send this to upstream.

Unfortunately, I couldn't take the DT changes in Samsung tree at that
time because of missing header file and it causes build error. Now I
can pick them into Samsung tree but I'm not sure it can be sent to
upstream during this -rc...

Eduardo, Lukasz,
Do you guys think the DT changes are really fixes for 4.0?

I've created following repository with DTS files:

https://github.com/lmajewski/linux-samsung-thermal.git

Branch: devel.

On top of the v4.0-rc1 tag you will find all necessary patches for
fixing thermal regression at Samsung Exynos boards.

I hope, that organizing all patches in a separate repository will
facilitate and speed up the inclusion process.

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Thanks in advance.

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Can you please provide a topic branch for it? If not, this cannot
be handled in arm-soc tree in this time, I think.

- Kukjin

-- 
Best regards,

Lukasz Majewski

Samsung R&D Institute Poland (SRPOL) | Linux Platform Group