RE: [PATCH 6/9] Thermal: Add Documentation to new APIs
From: R, Durgadoss <hidden>
Date: 2013-01-07 08:53:12
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-----Original Message----- From: Wei Ni [mailto:wni@nvidia.com] Sent: Monday, January 07, 2013 2:10 PM To: R, Durgadoss Cc: Zhang, Rui; linux-pm@vger.kernel.org; linux-kernel@vger.kernel.org; eduardo.valentin@ti.com; hongbo.zhang@linaro.org Subject: Re: [PATCH 6/9] Thermal: Add Documentation to new APIs On 01/07/2013 03:13 PM, Durgadoss R wrote:quoted
This patch adds Documentation for the new APIs introduced in this patch set. The documentation also has a model sysfs structure for reference. Signed-off-by: Durgadoss R <redacted> --- Documentation/thermal/sysfs-api2.txt | 248++++++++++++++++++++++++++++++++++quoted
1 file changed, 248 insertions(+) create mode 100644 Documentation/thermal/sysfs-api2.txtdiff --git a/Documentation/thermal/sysfs-api2.txtb/Documentation/thermal/sysfs-api2.txtquoted
new file mode 100644 index 0000000..ffd0402--- /dev/null +++ b/Documentation/thermal/sysfs-api2.txt@@ -0,0 +1,248 @@ +Thermal Framework +----------------- + +Written by Durgadoss R <durgadoss.r@intel.com> +Copyright (c) 2012 Intel Corporation + +Created on: 4 November 2012 +Updated on: 18 December 2012 + +0. Introduction +--------------- +The Linux thermal framework provides a set of interfaces for thermal +sensors and thermal cooling devices (fan, processor...) to register +with the thermal management solution and to be a part of it. + +This document focuses on how to enable new thermal sensors andcoolingquoted
+devices to participate in thermal management. This solution is intended +to be 'light-weight' and platform/architecture independent. Any thermal +sensor/cooling device should be able to use the infrastructure easily. + +The goal of thermal framework is to expose the thermal sensor/zone and +cooling device attributes in a consistent way. This will help the +thermal governors to make use of the information to manage platform +thermals efficiently. + +The thermal sensor source file can be generic (can be any sensor driver, +in any subsystem). This driver will use the sensor APIs and register with +thermal framework to participate in platform Thermal management. This +does not (and should not) know about which zone it belongs to, or any +other information about platform thermals. A sensor driver is astandalonequoted
+piece of code, which can optionally register with thermal framework. + +However, for any platform, there should be a platformX_thermal.c file, +which will know about the platform thermal characteristics (like how many +sensors, zones, cooling devices, etc.. And how they are related to eachotherquoted
+i.e the mapping information). Only in this file, the zone level APIs should +be used, in which case the file will have all information required to attach +various sensors to a particular zone. + +This way, we can have one platform level thermal file, which can support +multiple platforms (may be)using the same set of sensors (but)binded in +a different way. This file can get the platform thermal information +through Firmware, ACPI tables, device tree etc. + +Unfortunately, today we don't have many drivers that can be clearly +differentiated as 'sensor_file.c' and 'platform_thermal_file.c'. +But very soon we will need/have. The reason I am saying this is because +we are seeing a lot of chip drivers, starting to use thermal framework, +and we should keep it really light-weight for them to do so. + +An Example: drivers/hwmon/emc1403.c - a generic thermal chip driver +In one platform this sensor can belong to 'ZoneA' and in another the +same can belong to 'ZoneB'. But, emc1403.c does not really care about +where does it belong. It just reports temperature. + +1. Terminology +-------------- +This section describes the terminology used in the rest of this +document as well as the thermal framework code. + +thermal_sensor: Hardware that can report temperature of a particular + spot in the platform, where it is placed. The temperature + reported by the sensor is the 'real' temperature reported + by the hardware. +thermal_zone: A virtual area on the device, that gets heated up. It may + have one or more thermal sensors attached to it. +cooling_device: Any component that can help in reducing thetemperature ofquoted
+ a 'hot spot' either by reducing its performance (passive + cooling) or by other means(Active cooling E.g. Fan) + +trip_points: Various temperature levels for each sensor. As of now, we + have four levels namely active, passive, hot and critical. + Hot and critical trip point support only one value whereas + active and passive can have any number of values. These + temperature values can come from platform data, and are + exposed through sysfs in a consistent manner. Stand-alone + thermal sensor drivers are not expected to know these values. + These values are RO. +thresholds: These are programmable temperature limits, on reachingwhichquoted
+ the thermal sensor generates an interrupt. The framework is + notified about this interrupt to take appropriate action. + There can be as many number of thresholds as that of the + hardware supports. These values are RW.Hi, When generate interrupt, we could call something like notify_thermal_framework(), is it right? but it just notify the framework, how to notify the platform driver? I think the platform driver will wish to update the limited values when interrupt occur. Will we have a thermal zone fops like ops.notify()? I noticed there have "struct thermal_zone *ops" in the thermal_zone structure, will it be used for callback?
Yes, you are right. I missed adding a .notify() call back to thermal_zone ops. I will wait to see if we get more comments on this version of the patches. If so, will fix this in v3. Otherwise, will submit a patch, once these patches make it to Rui's tree. Hope this works for you :-) Thanks, Durga