[PATCH 3/6] dt-bindings: thermal: qcom-tsens: document qcm6490 tsens
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WARM3d
From: Gaurav Kohli <hidden>
Date: 2026-10-02 10:47:32
Also in:
linux-arm-msm, linux-devicetree, linux-pm, lkml
Subsystem:
arm/qualcomm mailing list, open firmware and flattened device tree bindings, qualcomm tsens thermal driver, the rest, thermal · Maintainers:
Rob Herring, Krzysztof Kozlowski, Conor Dooley, Amit Kucheria, Thara Gopinath, Linus Torvalds, Rafael J. Wysocki, Daniel Lezcano
From: Amit Kucheria <redacted> QCM6490 uses a tsens-v2 IP block and supports hardware-binned critical trip points. Add its compatible to the tsens-v2 enum. SoCs that support hardware-bin critical trips read their manufacturing bin from qfprom fuse cells rather than the usual calibration cells: a single "i-temp" bit on hamoa/purwa-class parts, and a "jtag-id"/ "feat-id" pair on sc7280/qcm6490. Extend nvmem-cell-names with two oneOf branches so these fuse-cell names validate. Signed-off-by: Amit Kucheria <redacted> Signed-off-by: Gaurav Kohli <redacted> --- Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 8 ++++++++ 1 file changed, 8 insertions(+)
diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index 5a8f7673e730..6899f07ec218 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml@@ -65,6 +65,7 @@ properties: - qcom,msm8996-tsens - qcom,msm8998-tsens - qcom,qcm2290-tsens + - qcom,qcm6490-tsens - qcom,qcs8300-tsens - qcom,qcs615-tsens - qcom,sa8255p-tsens
@@ -244,6 +245,13 @@ properties: - pattern: '^tsens_sens[0-9]+_off$' - pattern: '^tsens_sens[0-9]+_off$' - pattern: '^tsens_sens[0-9]+_off$' + # hardware-binning fuse cells: a single i-temp bit + - items: + - const: i-temp + # hardware-binning fuse cells: jtag-id and feature-id + - items: + - const: jtag-id + - const: feat-id "#qcom,sensors": description:
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2.34.1