Re: [PATCH v3 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices
From: Rob Herring <robh@kernel.org>
Date: 2020-03-31 21:16:10
Also in:
linux-arm-msm, linux-pm, lkml
From: Rob Herring <robh@kernel.org>
Date: 2020-03-31 21:16:10
Also in:
linux-arm-msm, linux-pm, lkml
On Wed, 25 Mar 2020 12:04:53 +0530, Amit Kucheria wrote:
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. cpus, gpus) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by: Amit Kucheria <redacted> --- .../thermal/thermal-cooling-devices.yaml | 116 ++++++++++++++++++ 1 file changed, 116 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
Reviewed-by: Rob Herring <robh@kernel.org>