Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings
From: Wangtao (Kevin, Kirin) <hidden>
Date: 2017-09-04 06:39:35
Also in:
linux-arm-kernel, linux-pm, lkml
在 2017/9/1 2:24, Daniel Lezcano 写道:
On 29/08/2017 10:17, Tao Wang wrote:quoted
From: Tao Wang <redacted> This adds documentation of device tree bindings for the thermal sensor controller of hi3660 SoC. Signed-off-by: Tao Wang <redacted> --- .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++ 1 file changed, 37 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txtdiff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt new file mode 100644 index 0000000..4643dbe --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt@@ -0,0 +1,37 @@ +* Temperature Sensor on hisilicon SoC + +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D +area contains a temperture sensor. The temperture sensor produces an output +value which has a linear relationship with the temperture of the area. +s/temperture/temperature/
THX
quoted
+for Hi3660, +sensor0 monitors the temperture of A53; +sensor1 monitors the temperture of A72; +sensor2 monitors the temperture of GPU; +sensor3 is a virtual sensor, which produces the maximum value of all sensors; +sensor4 is a virtual sensor, which produces the average value of all sensors.I don't think we need to escribe the virtual sensors in the DT bindings.
I just want to let user know the sensor id of virtual sensor, I also define it in header file, so the header file is enough?
quoted
+** Required properties : +- compatible: "hisilicon,thermal-tsensor". +- reg: physical reg address of thermal sensor and length of memory mapped + region. +- hisi,tsensors: number of hardware tsensors +- hisi,coef: An array of integers (one signed cell) containing + coefficients to turn adc value to temperture. +- hisi,adc-range: adc value range, minimum value is followed by maximum value. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : +Hi3660: +tsensor: tsensor@fff30000 { + compatible = "hisilicon,hi3660-tsensor"; + #address-cells = <2>; + #size-cells = <2>; + reg = <0x0 0xfff3001c 0x0 0x4>, + <0x0 0xfff3005c 0x0 0x4>, + <0x0 0xfff3009c 0x0 0x4>; + hisi,tsensors = <HISI_MAX_TSENSORS>; + hisi,coef = <165000 (-40000)>; + hisi,adc-range = <0x74 0x39A>;Do we really need max sensors, coef and adc range to be specified in the DT? Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the coef, adc, in the driver itself?
My purpose is to make the driver be compitable with our future platform.
Can't this binding be merged with the hisilicon-thermal.txt? Thanks. -- Daniel