Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings
From: Daniel Lezcano <hidden>
Date: 2017-08-31 18:24:30
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linux-arm-kernel, linux-pm, lkml
On 29/08/2017 10:17, Tao Wang wrote:
quoted hunk ↗ jump to hunk
From: Tao Wang <redacted> This adds documentation of device tree bindings for the thermal sensor controller of hi3660 SoC. Signed-off-by: Tao Wang <redacted> --- .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++ 1 file changed, 37 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txtdiff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt new file mode 100644 index 0000000..4643dbe --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt@@ -0,0 +1,37 @@ +* Temperature Sensor on hisilicon SoC + +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D +area contains a temperture sensor. The temperture sensor produces an output +value which has a linear relationship with the temperture of the area. +
s/temperture/temperature/
+for Hi3660, +sensor0 monitors the temperture of A53; +sensor1 monitors the temperture of A72; +sensor2 monitors the temperture of GPU; +sensor3 is a virtual sensor, which produces the maximum value of all sensors; +sensor4 is a virtual sensor, which produces the average value of all sensors.
I don't think we need to escribe the virtual sensors in the DT bindings.
+** Required properties :
+- compatible: "hisilicon,thermal-tsensor".
+- reg: physical reg address of thermal sensor and length of memory mapped
+ region.
+- hisi,tsensors: number of hardware tsensors
+- hisi,coef: An array of integers (one signed cell) containing
+ coefficients to turn adc value to temperture.
+- hisi,adc-range: adc value range, minimum value is followed by maximum value.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+Example :
+Hi3660:
+tsensor: tsensor@fff30000 {
+ compatible = "hisilicon,hi3660-tsensor";
+ #address-cells = <2>;
+ #size-cells = <2>;
+ reg = <0x0 0xfff3001c 0x0 0x4>,
+ <0x0 0xfff3005c 0x0 0x4>,
+ <0x0 0xfff3009c 0x0 0x4>;
+ hisi,tsensors = <HISI_MAX_TSENSORS>;
+ hisi,coef = <165000 (-40000)>;
+ hisi,adc-range = <0x74 0x39A>;Do we really need max sensors, coef and adc range to be specified in the DT? Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the coef, adc, in the driver itself? Can't this binding be merged with the hisilicon-thermal.txt? Thanks. -- Daniel -- <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | <http://twitter.com/#!/linaroorg> Twitter | <http://www.linaro.org/linaro-blog/> Blog