Re: [PATCH 3/3] usb: dwc3: introduce flatten model driver of i.MX Soc
From: Thinh Nguyen <Thinh.Nguyen@synopsys.com>
Date: 2026-02-03 00:45:28
Also in:
imx, linux-devicetree, linux-usb, lkml
On Mon, Feb 02, 2026, Frank Li wrote:
On Mon, Feb 02, 2026 at 06:27:47PM +0800, Xu Yang wrote:quoted
To support flatten dwc3 devicetree model, introduce a new driver. Signed-off-by: Xu Yang <xu.yang_2@nxp.com>
Can you include additional info to describe why this was needed (written in your cover letter). Also note any new feature supported by this glue that's not currently available in the old driver. Thanks, Thinh (ps. I'm thinking of creating a legacy_glues directory to start moving all the legacy glue drivers there)