On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote:

Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 AM654 supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.

Signed-off-by: Keerthy <j-keerthy@ti.com>
---

Changes in v2:

  * Fixed make dt_binding_check errors.

 .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
 1 file changed, 57 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml

My bot found errors running 'make dt_binding_check' on your patch:

Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node
Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error
FATAL ERROR: Unable to parse input tree
scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed
make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1
Makefile:1263: recipe for target 'dt_binding_check' failed
make: *** [dt_binding_check] Error 2

See https://patchwork.ozlabs.org/patch/1237882
Please check and re-submit.

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