Thread (21 messages) 21 messages, 5 authors, 2017-08-11

[PATCH v2 0/5] thermal: rockchip: add tsadc support in thermal driver and IPA thermal control for rk3328 in dts

From: rui.zhang@intel.com (Zhang Rui)
Date: 2017-08-11 08:04:37
Also in: linux-devicetree, linux-pm, linux-rockchip, lkml

On Fri, 2017-08-11 at 08:27 +0200, Heiko Stuebner wrote:
Hi,

Am Freitag, 11. August 2017, 12:51:35 CEST schrieb Zhang Rui:
quoted
On Fri, 2017-08-04 at 16:06 +0800, Rocky Hao wrote:
quoted
This series patches add the tsadc support in thermal driver and
in
devicetree for rk3328.
Also add thermal control with Intelligent Power Allocation (IPA)
policy by default.??Please
refer to https://developer.arm.com/open-source/intelligent-power-
allo
cation for more information
about IPA.

Rocky Hao (5):
? dt-bindings: rockchip-thermal: Support the RK3328 SoC
compatible
? thermal: rockchip: Support the RK3328 SOC in thermal driver
? arm64: dts: rockchip: add tsadc node for rk3328 SoC
? arm64: dts: rockchip: add thermal nodes for rk3328 SoC
? arm64: dts: rockchip: Enable tsadc module on RK3328 eavluation
board
I can take this patch set if we have ACK for patch 3, 4 and 5.
I would prefer if you would just apply patches 1+2 alone and I'd take
the devicetree patches through my tree.

Having devicetree stuff mingle in a lot of trees produces unnecessary
conflicts, so the general best practice is having code + binding.txt
going through the driver tree and devicetree stuff through the
platform
tree.
OKay, I will take patch 1 and 2 and queue them for next merge window.

thanks,
rui
Thanks
Heiko
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