On Thu, Sep 18, 2014 at 04:19:26PM +0200, Tomeu Vizoso wrote:

On 18 September 2014 15:25, Caesar Wang [off-list ref] wrote:

quoted

Tomeu,

? 2014?09?18? 17:27, Tomeu Vizoso ??:

quoted

On 17 September 2014 05:59, Caesar Wang [off-list ref]
wrote:

quoted

This add the necessary binding documentation for the thermal
found on Rockchip SoCs

Hi Caesar,

is there any reason to not use the existing thermal bindings? You can
find a description in
Documentation/devicetree/bindings/thermal/thermal.txt and example code
in omap, or in the patches for Tegra recently posted by Mikko
Perttunen.

Regards,

Tomeu

Why should I use the existing thermal bindings?

Because otherwise, you are asking to merge duplicated code. There's a
generic way to define thermal zones, trip points, cooling devices,
etc. And also code to parse and plug them together. Why add
soc-specific code to do the same?

quoted

I believe omap,tegar and rockchip are  the three seperate thermals driver.

Yes, and OMAP is already using the generic bindings, and the proposed
patches for Tegra as well, and I think it would make sense for
Rockchip to also use them (unless I'm missing something).

You are talking about drivers/thermal/of-thermal.c, right? Yes, I think
Rockchip should be using the same generic framework if possible.

Thanks.

-- 
Dmitry