Re: [PATCH v5 00/18] Self-encapsulate the thermal zone device structure

[PATCH v5 00/18] Self-encapsulate the thermal zone device structure · Daniel Lezcano <hidden> · 2023-03-01
[PATCH v5 04/18] thermal/core: Use the thermal zone 'devdata' accessor in remaining drivers · Daniel Lezcano <hidden> · 2023-03-01
[PATCH v5 13/18] thermal: Use thermal_zone_device_type() accessor · Daniel Lezcano <hidden> · 2023-03-01
Re: [PATCH v5 00/18] Self-encapsulate the thermal zone device structure · Daniel Lezcano <hidden> · 2023-03-03
Re: [PATCH v5 00/18] Self-encapsulate the thermal zone device structure · "Rafael J. Wysocki" <rafael@kernel.org> · 2023-03-03

From: "Rafael J. Wysocki" <rafael@kernel.org>
Date: 2023-03-03 19:48:52
Also in: linux-acpi, linux-arm-msm, linux-hwmon, linux-ide, linux-iio, linux-input, linux-mediatek, linux-omap, linux-pm, linux-renesas-soc, linux-samsung-soc, linux-sunxi, linux-tegra, linux-wireless, lkml

Hi Daniel,

On Fri, Mar 3, 2023 at 10:24 AM Daniel Lezcano
[off-list ref] wrote:


Hi Rafael,

Do we have enough ack to apply this series, is it for you ?

I've just queued it up for 6.4.

It will reach linux-next and the thermal branch some time next week,
but I will be traveling, so there may be delays.

Thanks!

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