Thread (3 messages) 3 messages, 2 authors, 2013-08-30

Re: [PATCH 0/5] bonding: Patchset for rcu use in bonding

From: Ding Tianhong <hidden>
Date: 2013-08-30 01:37:50

On 2013/8/29 22:28, Nikolay Aleksandrov wrote:
On 08/28/2013 06:20 AM, Ding Tianhong wrote:
quoted
Hi:

The Patch Set convert the xmit of 3ad and alb mode to use rcu lock.
replace and add more rcu list function.
fix a bug to protect bonding_store_xmit_hash().

I test well and no problems found till now.

Ding Tianhong (3):
Wang Yufen (1):
Yang Yingliang (1):
  bonding: simplify and use RCU protection for 3ad xmit path
  bonding: replace read_lock to rcu_read_lock for
  bond_3ad_get_active_agg_info()
  bonding: add rtnl lock for bonding_store_xmit_hash
  bonding: restructure and simplify bond_for_each_slave_next()
  bonding: use RCU protection for alb xmit path

 drivers/net/bonding/bond_3ad.c   | 35 +++++++++++++++-------------------
 drivers/net/bonding/bond_alb.c   | 23 ++++++++++------------
 drivers/net/bonding/bond_main.c  |  6 ++----
 drivers/net/bonding/bond_sysfs.c |  4 ++++
 drivers/net/bonding/bonding.h    | 41 ++++++++++++++++++++++++++++++++++++----
 5 files changed, 68 insertions(+), 41 deletions(-)
Thanks for the work, I was on vacation and travelling after my initial RCU
conversion so I got a little behind with these conversions, my idea was quite
different :-)
Anyway, I'd also appreciate some benchmarks, also some more information on what
type of testing did you run ?
I've given some preliminary comments to the patches, I'll have to think more
about them in this form.

Cheers,
 Nik

.
It looks like a wonderful vocation :).
I focus on the 3ad and alb mode, because the modify was manly for xmit, so my test environment was consist of 4 Intel82599 10G card, and use mode lacp ,alb.
I use iperf to test, after the patch, the performance was a little better and no problem
occurs. 
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