Re: [Bonding-devel] [PATCH net-next-2.6] bonding: remove meaningless /sys/module/bonding/parameters entries.

Le 03/01/2011 20:32, David Miller a écrit :

From: Nicolas de Pesloüan<redacted>
Date: Sun,  2 Jan 2011 15:35:15 +0100

quoted

Only two bonding parameters are exposed in /sys/module/bonding:

num_grat_arp
num_unsol_na

Those values are not module global, but per device.

The per device values are available in /sys/class/net/<device>/bonding.

The values exposed in /sys/module/bonding are those given at module load time
and only used as default values when creating a device. They are read-only and
cannot change in any way.

As such, they are mostly meaningless.

First, you forgot to provide a proper "Signed-off-by: " line in your
patch submission, please read Documentation/SubmittingPatches

Oups, you are right. I forgot it.

Secondly, you can't remove these, people might be using them.  It
could be useful, for example, to debug problems with passing module
parameters in.  This is the one way to find out what actually got
passed to the module when it loaded.

I perfectly understand this.

The bonding module supports 19 different parameters, but only two are exposed into /sys/modules/bonding. Also, only one of those parameters is global to the module (max_bonds). All other parameters are in fact per device and exposed (read and write if appropriate) in /sys/class/net/<device>/bonding.

As there is no good reason to have only those two parameters exposed into /sys/modules/bonding, we should remove them or add all the other one. Due to the lack of real global meaning for those two, I thought removing them was the right option.

Therefore I'm not applying this patch, sorry.

Anyway, thanks.

	Nicolas.