Re: [PATCH 1/4] bonding: fix device name allocation error

Jay Vosburgh wrote:

	The code to select names for the bonding interfaces was, for the
non-sysfs creation case, always using a hard-coded set of bond0, bond1,
etc, up to max_bonds.  This caused conflicts for the second or
subsequent loads of the module.

	Changed the code to obtain device names from dev_alloc_name().

Signed-off-by: Jay Vosburgh <redacted>

applied 1-4 to #upstream