Arthur,
Thanks for the reply.
Not yet. Will try out the patch.

Ravi

-----Original Message-----
From: Arthur Kepner [mailto:akepner@sgi.com]
Sent: Tuesday, March 29, 2005 10:29 AM
To: Ravinandan Arakali
Cc: netdev@oss.sgi.com; bonding-devel@lists.sourceforge.net; Leonid.
Grossman (E-mail); Raghavendra. Koushik (E-mail)
Subject: Re: High CPU utilization with Bonding driver ?



On Tue, 29 Mar 2005, Ravinandan Arakali wrote:

....
Results(8 nttcp/chariot streams):
---------------------------------
1. Combined throughputs(but no bonding):
3.1 + 6.2 = 9.3 Gbps with 58% CPU idle.

2. eth0 and eth1 bonded together in LACP mode:
8.2 Gbps with 1% CPU idle.

From the above results, when Bonding driver is used(#2), the CPUs are
completely maxed out compared to the case when traffic is run
simultaneously on both the cards(#1).
Can anybody suggest some reasons for the above behavior ?

Ravi;

Have you tried this patch? 

http://marc.theaimsgroup.com/?l=linux-netdev&m=111091146828779&w=2

If not, it will likely go a long way to solving your 
problem.

--
Arthur