Re: [RFC] the generic thermal layer enhancement
From: Matthew Garrett <mjg59@srcf.ucam.org>
Date: 2012-05-30 12:50:47
Also in:
linux-acpi
On Wed, May 30, 2012 at 04:49:02PM +0800, Zhang Rui wrote:
G1. supporting multiple cooling states for active cooling devices.
Sounds fine.
G2. introduce cooling states range for a certain trip point
Again, no problem here.
G3. kernel thermal passive cooling algorithm
Currently, tc1 and tc2 are hard requirements for kernel passive
cooling. But non-ACPI platforms do not have this information
(please correct me if I'm wrong).
Say, for the patches here
http://marc.info/?l=linux-acpi&m=133681581305341&w=2
They just want to slow down the processor when current temperature
is higher than the trip point and speed up the processor when the
temperature is lower than the trip point.Just slowing the CPU down above a certain temperature is a pretty awful approach to passive cooling. You want to maximise performance while staying within your thermal envelope, so you need a more advanced approach. The existing algorithm provides a generic mechanism for balancing performance and thermal output, with the only requirement being that the platform provide constants that represent the heating and cooling properties of the system. I don't fundamentally object to adding support for platform-specific passive formulae, but I'd like an explanation for how they're better than the existing one.
G4. Multiple passive trip points
It would be good to have an explanation of the use case here. If it's acceptable for the device to be at the lower passive trip point, why are we slowing it down at all? -- Matthew Garrett | mjg59@srcf.ucam.org