RE: [PATCH v3 08/23] mtd: spi-nor: winbond: Prepare introduction of W25QxxRV-Q/N parts

There is an ID collision between the JV and RV families. Both chips are
very similar in practice, it is mostly a matter of electrical
differences (mostly power consumption being lower).

As a significant difference, RV chips identify themselves as supporting
the new SFDP (rev F) field which forces an alternate write SR2 opcode
(0x31). They also do not require the multi-die fixups which must remain
assigned to the JV chips.

Finally, since they share the IDs but not the names, we must hide the
names using a fixup.

Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>

Reviewed-by: Takahiro Kuwano <takahiro.kuwano@infineon.com>