Thread (11 messages) 11 messages, 3 authors, 2022-02-18
STALE1614d
Revisions (5)
  1. rfc [diff vs current]
  2. v2 [diff vs current]
  3. v3 [diff vs current]
  4. v4 current
  5. v5 [diff vs current]

[PATCH v4 0/4] i.MX8MP: more USB3 glue layer feature support

From: Alexander Stein <hidden>
Date: 2022-01-26 14:13:54
Also in: linux-arm-kernel, linux-usb

Hi all,

Thanks for the feedback on v3 [1].

This patchset aims to support flags for e.g. over-current active low or port
permanantly attached which are provided in the USB3 glue layer.

In v4 the patchset depends on Lucas' i.MX8MP power-domains patchset [2].
Because of that the 'phy' clock usage can be dropped, as now power domains
take care of the clocks. Due to powering up/down the glue layer settings
will have to be reapplied during resume.

Changes in v4:
* Depends on Lucas' i.MX8MP power-domains patchset
* removed 'phy' clock usage from dwc3-imx8mp.c
* Reapply glue layer settings upon resume

Changes in v3:
* Rename existing member for clarity
* Moved feature implementation from phy-fsl-imx8mq-usb.c to dwc3-imx8mp.c

[1] https://patchwork.kernel.org/project/linux-arm-kernel/cover/20220118131626.926394-1-alexander.stein@ew.tq-group.com/
[2] https://patchwork.kernel.org/project/linux-arm-kernel/cover/20220119134027.2931945-1-l.stach@pengutronix.de/

Alexander Stein (4):
  usb: dwc3: imx8mp: rename iomem base pointer
  dt-bindings: usb: dwc3-imx8mp: Add imx8mp specific flags
  usb: dwc3: imx8mp: Add support for setting SOC specific flags
  arm64: dts: imx8mp: Add memory for USB3 glue layer to usb3 nodes

 .../bindings/usb/fsl,imx8mp-dwc3.yaml         | 31 +++++++-
 arch/arm64/boot/dts/freescale/imx8mp.dtsi     |  6 +-
 drivers/usb/dwc3/dwc3-imx8mp.c                | 76 +++++++++++++++++--
 3 files changed, 100 insertions(+), 13 deletions(-)

-- 
2.25.1
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