Thread (20 messages) 20 messages, 5 authors, 2021-01-28

Re: [PATCH v6 3/4] usb: dwc3: Resize TX FIFOs to meet EP bursting requirements

From: Wesley Cheng <hidden>
Date: 2021-01-26 12:20:05
Also in: linux-arm-msm, linux-usb, lkml


On 1/25/2021 5:55 PM, Bjorn Andersson wrote:
On Mon 25 Jan 19:14 CST 2021, Wesley Cheng wrote:
quoted

On 1/22/2021 9:12 AM, Bjorn Andersson wrote:
quoted
On Thu 21 Jan 22:01 CST 2021, Wesley Cheng wrote:
Hi Bjorn,
quoted
Under what circumstances should we specify this? And in particular are
there scenarios (in the Qualcomm platforms) where this must not be set?
The TXFIFO dynamic allocation is actually a feature within the DWC3
controller, and isn't specifically for QCOM based platforms.  It won't
do any harm functionally if this flag is not set, as this is meant for
enhancing performance/bandwidth.
quoted
In particular, the composition can be changed in runtime, so should we
set this for all Qualcomm platforms?
Ideally yes, if we want to increase bandwith for situations where SS
endpoint bursting is set to a higher value.
quoted
And if that's the case, can we not just set it from the qcom driver?
Since this is a common DWC3 core feature, I think it would make more
sense to have it in DWC3 core instead of a vendor's DWC3 glue driver.
I don't have any objections to implementing it in the core driver, but
my question is can we just skip the DT binding and just enable it from
the vendor driver?

Regards,
Bjorn
Hi Bjorn,

I see.  I think there are some designs which don't have a DWC3 glue
driver, so assuming there may be other platforms using this, there may
not always be a vendor driver to set this.

Thanks
Wesley Cheng

-- 
The Qualcomm Innovation Center, Inc. is a member of the Code Aurora Forum,
a Linux Foundation Collaborative Project
Keyboard shortcuts
hback out one level
jnext message in thread
kprevious message in thread
ldrill in
Escclose help / fold thread tree
?toggle this help