On Sat, Oct 03, 2020 at 08:02:03PM +0800, Li Jun wrote:

NXP imx8MPlus integrates 2 indentical dwc3 3.30b IP with additional wakeup
logic to support low power, this wakeup logic has a separated interrupt
which can generate events with suspend clock(32K); due to SoC integration
limitation, it only can support 32 bits DMA, so add dma-ranges property,

changes for v5
- Remove "Items" of compatible in binding doc [1/4]
- Add Krzysztof's R-b tag for patches [3-4/4].

changes for v4:
- Use dma-ranges property to limit 32bits DMA, so don't need the new
  property "xhci-64bit-support-disable".
- Fix binding doc to pass dt_binding_check dtbs_check.

changes for v3:
- Add dwc3 core related clocks into dwc3 core node, and glue layer driver
  only handle the clocks(hsio and suspend) for glue block, this is to
  match real HW.
- Change to use property "xhci-64bit-support-disable" to disable 64bit DMA
  as imx8mp USB integration actully can't support it, so remove platform
  data in v2.
- Some changes of imx8mp usb driver binding doc to address comments from Rob

Changes for v2:
- Drop the 2 patches for new property("snps,xhci-dis-64bit-support-quirk")
  introduction, as suggested, imply by SoC compatible string, this is done
  by introduce dwc3 core platform data and pass the xhci_plat_priv to
  xhci-plat for those xhci quirks, so a new patch added:
  [1/5] usb: dwc3: add platform data to dwc3 core device to pass data.
  this patch is based on Peter's one patch which is also in review:
  https://patchwork.kernel.org/patch/11640945/
- dts change, use the USB power function of TRL logic instead of a always-on
  regulator to control vbus on/off.
- Some changes to address Peter's command on patch [2/5].

Li Jun (4):
  dt-bindings: usb: dwc3-imx8mp: add imx8mp dwc3 glue bindings
  usb: dwc3: add imx8mp dwc3 glue layer driver
  arm64: dtsi: imx8mp: add usb nodes
  arm64: dts: imx8mp-evk: enable usb1 as host mode

The last two dts patches look good to me.  Ping me for applying after
the first two are accepted.

Shawn