* Yegor Yefremov [off-list ref] [170112 00:00]:

On Thu, Jan 12, 2017 at 1:47 AM, Tony Lindgren [off-list ref] wrote:

quoted

* Yegor Yefremov [off-list ref] [170111 13:52]:

quoted

On Wed, Jan 11, 2017 at 3:05 PM,  [off-list ref] wrote:

quoted

From: Yegor Yefremov <yegorslists-gM/Ye1E23mwN+BqQ9rBEUg@public.gmane.org>

This is an attempt to revive DT support for TI HECC that was started in 2015.

I haven't changed much because not all questions could be fully answered:

* Should HECC use "am3505" as compatible?

I mean "ti,am3505-hecc"

Yeah it should use the device name for the driver.

quoted

quoted

* What should be done to the offsets (ti,scc-ram-offset, ti,hecc-ram-offset, ti,mbx-offset)?

The devicetree maintainers need to ack the binding doc. Maybe
send that as a first patch?

The question is whether to place these settings into dtsi (as it was
done in the original patch) or in the driver itself.

Well where are they on the SoC? Each driver should only access registers
that belong to the driver module.

If the ti,scc-ram-offset and ti,hecc-ram-offset are not within the ECC
driver module, probably you should use a separate driver for them
such as drivers/misc/sram.c.

Also, sounds like the ti,mbx-offset should just be using the mailbox
framework like remoteproc is doing with include/linux/omap-mailbox.h?

Regards,

Tony
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