RE: [PATCH v2 2/3] dt-bindings: usb: Introduce samsung,snps-dwc3

-----Original Message-----
From: Selvarasu Ganesan <redacted>
Sent: Wednesday, September 16, 2026 5:52 PM
To: krzk@kernel.org; peter.griffin@linaro.org; alim.akhtar@samsung.com;
gregkh@linuxfoundation.org; robh@kernel.org; conor+dt@kernel.org;
Thinh.Nguyen@synopsys.com; mani@kernel.org;
selvarasu.g@samsung.com; linux-arm-kernel@lists.infradead.org; linux-
samsung-soc@vger.kernel.org; linux-usb@vger.kernel.org;
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Cc: jh0801.jung@samsung.com; h10.kim@samsung.com;
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hongpooh.kim@samsung.com; eomji.oh@samsung.com;
shijie.cai@samsung.com; muhammed.ali@samsung.com;
thiagu.r@samsung.com
Subject: [PATCH v2 2/3] dt-bindings: usb: Introduce samsung,snps-dwc3

Add the Samsung Exynos8855 DWC3 binding using a flattened node
representation, where the DWC3 controller is directly addressable rather
than nested as a child node of a glue layer.

This is the first Samsung Exynos binding using the flattened representation.
The existing samsung,exynos-dwc3 binding describes the parent and child
representation used by existing Exynos SoCs, which can be migrated to the
flattened model.

Samsung Exynos SoCs sharing the same flattened model can be added by
using the samsung,snps-dwc3 fallback compatible and extending the
compatible enum with per SoC clock and property constraints.

Co-developed-by: Muhammed Ali <redacted>
Signed-off-by: Muhammed Ali <redacted>
Signed-off-by: Selvarasu Ganesan <redacted>
---

Thanks for using flattened node representation. Are you planning to migrate other existing SoC as well?

Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>