Thread (13 messages) 13 messages, 4 authors, 2024-09-06

Re: [PATCH v3 6/6] dt-bindings: thermal: samsung,exynos: remove driver-specific information

From: "Rob Herring (Arm)" <robh@kernel.org>
Date: 2024-08-12 16:41:42
Also in: linux-devicetree, linux-pm, linux-samsung-soc, lkml

On Wed, 07 Aug 2024 10:48:25 +0200, Mateusz Majewski wrote:
The number of supported trip points was only limited by the driver
implementation at the time, which mapped each trip point defined in the
devicetree source file to a hardware trip point. An implementation that
does not have this limitation is possible; indeed, that is how the
driver works currently. Therefore, this information should be removed
from the bindings description, which are meant to be independent of
the details of the driver implementation.

Reviewed-by: Sam Protsenko <semen.protsenko@linaro.org>
Signed-off-by: Mateusz Majewski <redacted>
---
v2 -> v3: reword the commit message to be easier to understand in
  context of dt-bindings.
v1 -> v2: remove an unnecessary sentence.

 .../devicetree/bindings/thermal/samsung,exynos-thermal.yaml | 6 +-----
 1 file changed, 1 insertion(+), 5 deletions(-)
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>

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