Re: [PATCH v1 04/22] docs: thermal: convert to ReST
From: Zhang Rui <rui.zhang@intel.com>
Date: 2019-06-25 14:22:01
Also in:
linux-doc, linux-pm, linux-samsung-soc, lkml
On 二, 2019-06-25 at 10:53 -0300, Mauro Carvalho Chehab wrote:
Em Tue, 25 Jun 2019 21:40:11 +0800 Zhang Rui [off-list ref] escreveu:quoted
On 二, 2019-06-18 at 18:05 -0300, Mauro Carvalho Chehab wrote:quoted
Rename the thermal documentation files to ReST, add an index for them and adjust in order to produce a nice html output via the Sphinx build system. At its new index.rst, let's add a :orphan: while this is not linked to the main index.rst file, in order to avoid build warnings. Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org>Acked-by: Zhang Rui <rui.zhang@intel.com> should I apply this patch or you have a separate tree for all these changes?Feel free to apply it directly to your tree. The patches on this series are pretty much independent.
okay, queued for 5.3-rc1. thanks, rui
quoted
thanks, ruiquoted
--- ...pu-cooling-api.txt => cpu-cooling-api.rst} | 39 +- .../{exynos_thermal => exynos_thermal.rst} | 47 +- ...emulation => exynos_thermal_emulation.rst} | 66 +-- Documentation/thermal/index.rst | 18 + ...el_powerclamp.txt => intel_powerclamp.rst} | 177 +++---- .../{nouveau_thermal => nouveau_thermal.rst} | 54 +- ...ower_allocator.txt => power_allocator.rst} | 140 ++--- .../thermal/{sysfs-api.txt => sysfs-api.rst} | 490 ++++++++++++-- ---- ...hermal => x86_pkg_temperature_thermal.rst} | 28 +- MAINTAINERS | 2 +- include/linux/thermal.h | 4 +- 11 files changed, 665 insertions(+), 400 deletions(-) rename Documentation/thermal/{cpu-cooling-api.txt => cpu- cooling- api.rst} (82%) rename Documentation/thermal/{exynos_thermal => exynos_thermal.rst} (67%) rename Documentation/thermal/{exynos_thermal_emulation => exynos_thermal_emulation.rst} (36%) create mode 100644 Documentation/thermal/index.rst rename Documentation/thermal/{intel_powerclamp.txt => intel_powerclamp.rst} (76%) rename Documentation/thermal/{nouveau_thermal => nouveau_thermal.rst} (64%) rename Documentation/thermal/{power_allocator.txt => power_allocator.rst} (74%) rename Documentation/thermal/{sysfs-api.txt => sysfs-api.rst} (66%) rename Documentation/thermal/{x86_pkg_temperature_thermal => x86_pkg_temperature_thermal.rst} (80%)diff --git a/Documentation/thermal/cpu-cooling-api.txtb/Documentation/thermal/cpu-cooling-api.rst similarity index 82% rename from Documentation/thermal/cpu-cooling-api.txt rename to Documentation/thermal/cpu-cooling-api.rst index 7df567eaea1a..645d914c45a6 100644--- a/Documentation/thermal/cpu-cooling-api.txt +++ b/Documentation/thermal/cpu-cooling-api.rst@@ -1,5 +1,6 @@ +=======================CPU cooling APIs How To -=================================== +======================= Written by Amit Daniel Kachhap [off-list ref]@@ -8,40 +9,54 @@ Updated: 6 Jan 2015Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.sams ung. com) 0. Introduction +=============== The generic cpu cooling(freq clipping) provides registration/unregistration APIs to the caller. The binding of the cooling devices to the trip point is left for the user. The registration APIs returns the cooling device pointer. 1. cpu cooling APIs +=================== 1.1 cpufreq registration/unregistration APIs -1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( - struct cpumask *clip_cpus) +-------------------------------------------- + + :: + + struct thermal_cooling_device + *cpufreq_cooling_register(struct cpumask *clip_cpus) This interface function registers the cpufreq cooling device with the name "thermal-cpufreq-%x". This api can support multiple instances of cpufreq cooling devices. - clip_cpus: cpumask of cpus where the frequency constraints will happen. + clip_cpus: + cpumask of cpus where the frequency constraints will happen. -1.1.2 struct thermal_cooling_device *of_cpufreq_cooling_register( - struct cpufreq_policy *policy) + :: + + struct thermal_cooling_device + *of_cpufreq_cooling_register(struct cpufreq_policy *policy) This interface function registers the cpufreq cooling device with the name "thermal-cpufreq-%x" linking it with a device tree node, in order to bind it via the thermal DT code. This api can support multiple instances of cpufreq cooling devices. - policy: CPUFreq policy. + policy: + CPUFreq policy. -1.1.3 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) + + :: + + void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) This interface function unregisters the "thermal-cpufreq-%x" cooling device. cdev: Cooling device pointer which has to be unregistered. 2. Power models +=============== The power API registration functions provide a simple power model for CPUs. The current power is calculated as dynamic power (static power isn't@@ -65,9 +80,9 @@ For a given processor implementation theprimary factors are: variation. In pathological cases this variation can be significant, but typically it is of a much lesser impact than the factors above. -A high level dynamic power consumption model may then be represented as: +A high level dynamic power consumption model may then be represented as:: -Pdyn = f(run) * Voltage^2 * Frequency * Utilisation + Pdyn = f(run) * Voltage^2 * Frequency * Utilisation f(run) here represents the described execution behaviour and its result has a units of Watts/Hz/Volt^2 (this often expressed in@@ -80,9 +95,9 @@ factors. Therefore, in initial implementationthat contribution is represented as a constant coefficient. This is a simplification consistent with the relative contribution to overall power variation. -In this simplified representation our model becomes: +In this simplified representation our model becomes:: -Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation + Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation Where `capacitance` is a constant that represents an indicative running time dynamic power coefficient in fundamental units ofdiff --git a/Documentation/thermal/exynos_thermalb/Documentation/thermal/exynos_thermal.rst similarity index 67% rename from Documentation/thermal/exynos_thermal rename to Documentation/thermal/exynos_thermal.rst index 9010c4416967..5bd556566c70 100644--- a/Documentation/thermal/exynos_thermal +++ b/Documentation/thermal/exynos_thermal.rst@@ -1,8 +1,11 @@ +========================Kernel driver exynos_tmu -================= +======================== Supported chips: + * ARM SAMSUNG EXYNOS4, EXYNOS5 series of SoC + Datasheet: Not publicly available Authors: Donggeun Kim [off-list ref]@@ -19,32 +22,39 @@ Temperature can be taken from the temperaturecode. There are three equations converting from temperature to temperature code. The three equations are: - 1. Two point trimming + 1. Two point trimming:: + Tc = (T - 25) * (TI2 - TI1) / (85 - 25) + TI1 - 2. One point trimming + 2. One point trimming:: + Tc = T + TI1 - 25 - 3. No trimming + 3. No trimming:: + Tc = T + 50 - Tc: Temperature code, T: Temperature, - TI1: Trimming info for 25 degree Celsius (stored at TRIMINFO register) + Tc: + Temperature code, T: Temperature, + TI1: + Trimming info for 25 degree Celsius (stored at TRIMINFO register) Temperature code measured at 25 degree Celsius which is unchanged - TI2: Trimming info for 85 degree Celsius (stored at TRIMINFO register) + TI2: + Trimming info for 85 degree Celsius (stored at TRIMINFO register) Temperature code measured at 85 degree Celsius which is unchanged TMU(Thermal Management Unit) in EXYNOS4/5 generates interrupt when temperature exceeds pre-defined levels. The maximum number of configurable threshold is five. -The threshold levels are defined as follows: +The threshold levels are defined as follows:: + Level_0: current temperature > trigger_level_0 + threshold Level_1: current temperature > trigger_level_1 + threshold Level_2: current temperature > trigger_level_2 + threshold Level_3: current temperature > trigger_level_3 + threshold - The threshold and each trigger_level are set - through the corresponding registers. +The threshold and each trigger_level are set +through the corresponding registers. When an interrupt occurs, this driver notify kernel thermal framework with the function exynos_report_trigger.@@ -54,24 +64,27 @@ it can be used to synchronize the coolingaction. TMU driver description: ----------------------- -The exynos thermal driver is structured as, +The exynos thermal driver is structured as:: Kernel Core thermal framework (thermal_core.c, step_wise.c, cpu_cooling.c) ^ | | -TMU configuration data -------> TMU Driver <------> Exynos Core thermal wrapper -(exynos_tmu_data.c) (exynos_tmu.c) (exyno s_th ermal_common.c) -(exynos_tmu_data.h) (exynos_tmu.h) (exyno s_th ermal_common.h) + TMU configuration data -----> TMU Driver <----> Exynos Core thermal wrapper + (exynos_tmu_data.c) (exynos_tmu.c) (exy nos_ thermal_common.c) + (exynos_tmu_data.h) (exynos_tmu.h) (exy nos_ thermal_common.h) -a) TMU configuration data: This consist of TMU register offsets/bitfields +a) TMU configuration data: + This consist of TMU register offsets/bitfields described through structure exynos_tmu_registers. Also several other platform data (struct exynos_tmu_platform_data) members are used to configure the TMU. -b) TMU driver: This component initialises the TMU controller and sets different +b) TMU driver: + This component initialises the TMU controller and sets different thresholds. It invokes core thermal implementation with the call exynos_report_trigger. -c) Exynos Core thermal wrapper: This provides 3 wrapper function to use the +c) Exynos Core thermal wrapper: + This provides 3 wrapper function to use the Kernel core thermal framework. They are exynos_unregister_thermal, exynos_register_thermal and exynos_report_trigger.diff --git a/Documentation/thermal/exynos_thermal_emulationb/Documentation/thermal/exynos_thermal_emulation.rst similarity index 36% rename from Documentation/thermal/exynos_thermal_emulation rename to Documentation/thermal/exynos_thermal_emulation.rst index b15efec6ca28..c21d10838bc5 100644--- a/Documentation/thermal/exynos_thermal_emulation +++ b/Documentation/thermal/exynos_thermal_emulation.rst@@ -1,5 +1,6 @@ -EXYNOS EMULATION MODE -======================== +===================== +Exynos Emulation Mode +=====================Copyright (C) 2012 Samsung Electronics@@ -8,46 +9,53 @@ Written by Jonghwa Lee <jonghwa3.lee@samsung.com> Description ----------- -Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal management unit. -Thermal emulation mode supports software debug for TMU's operation. User can set temperature -manually with software code and TMU will read current temperature from user value not from -sensor's value. +Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal +management unit. Thermal emulation mode supports software debug for +TMU's operation. User can set temperature manually with software code +and TMU will read current temperature from user value not from sensor's +value. -Enabling CONFIG_THERMAL_EMULATION option will make this support available. -When it's enabled, sysfs node will be created as +Enabling CONFIG_THERMAL_EMULATION option will make this support +available. When it's enabled, sysfs node will be created as /sys/devices/virtual/thermal/thermal_zone'zone id'/emul_temp. -The sysfs node, 'emul_node', will contain value 0 for the initial state. When you input any -temperature you want to update to sysfs node, it automatically enable emulation mode and -current temperature will be changed into it. -(Exynos also supports user changeable delay time which would be used to delay of - changing temperature. However, this node only uses same delay of real sensing time, 938us.) +The sysfs node, 'emul_node', will contain value 0 for the initial state. +When you input any temperature you want to update to sysfs node, it +automatically enable emulation mode and current temperature will be +changed into it. -Exynos emulation mode requires synchronous of value changing and enabling. It means when you -want to update the any value of delay or next temperature, then you have to enable emulation -mode at the same time. (Or you have to keep the mode enabling.) If you don't, it fails to -change the value to updated one and just use last succeessful value repeatedly. That's why -this node gives users the right to change termerpature only. Just one interface makes it more -simply to use. +(Exynos also supports user changeable delay time which would be used to +delay of changing temperature. However, this node only uses same delay +of real sensing time, 938us.) + +Exynos emulation mode requires synchronous of value changing and +enabling. It means when you want to update the any value of delay or +next temperature, then you have to enable emulation mode at the same +time. (Or you have to keep the mode enabling.) If you don't, it fails to +change the value to updated one and just use last succeessful value +repeatedly. That's why this node gives users the right to change +termerpature only. Just one interface makes it more simply to use. Disabling emulation mode only requires writing value 0 to sysfs node. +:: -TEMP 120 | + + TEMP 120 | | 100 | | 80 | - | +----------- - 60 | | | - | +-------------| | + | +----------- + 60 | | | + | +-------------| | 40 | | | | - | | | | - 20 | | | +- --------- - | | | | | + | | | | + 20 | | | + ---- ------ + | | | | | 0quoted
______________|_____________|__________|__________|_________- A A A A TIME + A A A A TIME |<----->| |<----->| |<----->| | | 938us | | | | | | -emulation : 0 50 | 70 | 20 | 0 -current temp : sensor 50 70 20 sensor + emulation : 0 50 | 70 | 20 | 0 + current temp: sensor 50 70 20 sensordiff --git a/Documentation/thermal/index.rstb/Documentation/thermal/index.rst new file mode 100644 index 000000000000..8c1c00146cad--- /dev/null +++ b/Documentation/thermal/index.rst@@ -0,0 +1,18 @@ +:orphan: + +======= +Thermal +======= + +.. toctree:: + :maxdepth: 1 + + cpu-cooling-api + sysfs-api + power_allocator + + exynos_thermal + exynos_thermal_emulation + intel_powerclamp + nouveau_thermal + x86_pkg_temperature_thermaldiff --git a/Documentation/thermal/intel_powerclamp.txtb/Documentation/thermal/intel_powerclamp.rst similarity index 76% rename from Documentation/thermal/intel_powerclamp.txt rename to Documentation/thermal/intel_powerclamp.rst index b5df21168fbc..3f6dfb0b3ea6 100644--- a/Documentation/thermal/intel_powerclamp.txt +++ b/Documentation/thermal/intel_powerclamp.rst@@ -1,10 +1,13 @@ - ======================= - INTEL POWERCLAMP DRIVER - ======================= -By: Arjan van de Ven <arjan@linux.intel.com> - Jacob Pan <jacob.jun.pan@linux.intel.com> +======================= +Intel Powerclamp Driver +======================= + +By: + - Arjan van de Ven <arjan@linux.intel.com> + - Jacob Pan <jacob.jun.pan@linux.intel.com> + +.. Contents:-Contents: (*) Introduction - Goals and Objectives@@ -23,7 +26,6 @@ Contents:- Generic Thermal Layer (sysfs) - Kernel APIs (TBD) -============ INTRODUCTION ============@@ -47,7 +49,6 @@ scalability, and user experience. In manycases, clear advantage is shown over taking the CPU offline or modulating the CPU clock. -=================== THEORY OF OPERATION ===================@@ -57,11 +58,12 @@ Idle InjectionOn modern Intel processors (Nehalem or later), package level C- state residency is available in MSRs, thus also available to the kernel. -These MSRs are: - #define MSR_PKG_C2_RESIDENCY 0x60D - #define MSR_PKG_C3_RESIDENCY 0x3F8 - #define MSR_PKG_C6_RESIDENCY 0x3F9 - #define MSR_PKG_C7_RESIDENCY 0x3FA +These MSRs are:: + + #define MSR_PKG_C2_RESIDENCY 0x60D + #define MSR_PKG_C3_RESIDENCY 0x3F8 + #define MSR_PKG_C6_RESIDENCY 0x3F9 + #define MSR_PKG_C7_RESIDENCY 0x3FA If the kernel can also inject idle time to the system, then a closed-loop control system can be established that manages package@@ -96,19 +98,21 @@ are not masked. Tests show that the extrawakeups from scheduler tick have a dramatic impact on the effectiveness of the powerclamp driver on large scale systems (Westmere system with 80 processors). -CPU0 - ____________ ____________ -kidle_inject/0 | sleep | mwait | sleep | - _________| |________| |_______ - duration -CPU1 - ____________ ____________ -kidle_inject/1 | sleep | mwait | sleep | - _________| |________| |_______ - ^ - | - | - roundup(jiffies, interval) +:: + + CPU0 + ____________ ____________ + kidle_inject/0 | sleep | mwait | sleep | + _________| |________| |_______ + duration + CPU1 + ____________ ____________ + kidle_inject/1 | sleep | mwait | sleep | + _________| |________| |_______ + ^ + | + | + roundup(jiffies, interval) Only one CPU is allowed to collect statistics and update global control parameters. This CPU is referred to as the controlling CPU in@@ -148,7 +152,7 @@ b) determine the amount of compensationneeded at each target ratio Compensation to each target ratio consists of two parts: - a) steady state error compensation + a) steady state error compensation This is to offset the error occurring when the system can enter idle without extra wakeups (such as external interrupts).@@ -158,41 +162,42 @@ Compensation to each target ratio consistsof two parts: slowing down CPU activities. A debugfs file is provided for the user to examine compensation -progress and results, such as on a Westmere system. -[jacob@nex01 ~]$ cat -/sys/kernel/debug/intel_powerclamp/powerclamp_calib -controlling cpu: 0 -pct confidence steady dynamic (compensation) -0 0 0 0 -1 1 0 0 -2 1 1 0 -3 3 1 0 -4 3 1 0 -5 3 1 0 -6 3 1 0 -7 3 1 0 -8 3 1 0 -... -30 3 2 0 -31 3 2 0 -32 3 1 0 -33 3 2 0 -34 3 1 0 -35 3 2 0 -36 3 1 0 -37 3 2 0 -38 3 1 0 -39 3 2 0 -40 3 3 0 -41 3 1 0 -42 3 2 0 -43 3 1 0 -44 3 1 0 -45 3 2 0 -46 3 3 0 -47 3 0 0 -48 3 2 0 -49 3 3 0 +progress and results, such as on a Westmere system:: + + [jacob@nex01 ~]$ cat + /sys/kernel/debug/intel_powerclamp/powerclamp_calib + controlling cpu: 0 + pct confidence steady dynamic (compensation) + 0 0 0 0 + 1 1 0 0 + 2 1 1 0 + 3 3 1 0 + 4 3 1 0 + 5 3 1 0 + 6 3 1 0 + 7 3 1 0 + 8 3 1 0 + ... + 30 3 2 0 + 31 3 2 0 + 32 3 1 0 + 33 3 2 0 + 34 3 1 0 + 35 3 2 0 + 36 3 1 0 + 37 3 2 0 + 38 3 1 0 + 39 3 2 0 + 40 3 3 0 + 41 3 1 0 + 42 3 2 0 + 43 3 1 0 + 44 3 1 0 + 45 3 2 0 + 46 3 3 0 + 47 3 0 0 + 48 3 2 0 + 49 3 3 0 Calibration occurs during runtime. No offline method is available. Steady state compensation is used only when confidence levels of all@@ -217,9 +222,8 @@ keeps track of clamping kernel threads, evenafter they are migrated to other CPUs, after a CPU offline event. -===================== Performance Analysis -===================== +==================== This section describes the general performance data collected on multiple systems, including Westmere (80P) and Ivy Bridge (4P, 8P).@@ -257,16 +261,15 @@ achieve up to 40% better performance perwatt. (measured by a spin counter summed over per CPU counting threads spawned for all running CPUs). -==================== Usage and Interfaces ==================== The powerclamp driver is registered to the generic thermal layer as a -cooling device. Currently, it’s not bound to any thermal zones. +cooling device. Currently, it’s not bound to any thermal zones:: -jacob@chromoly:/sys/class/thermal/cooling_device14$ grep . * -cur_state:0 -max_state:50 -type:intel_powerclamp + jacob@chromoly:/sys/class/thermal/cooling_device14$ grep . * + cur_state:0 + max_state:50 + type:intel_powerclamp cur_state allows user to set the desired idle percentage. Writing 0 to cur_state will stop idle injection. Writing a value between 1 and@@ -278,9 +281,9 @@ cur_state returns value -1 instead of 0 whichis to avoid confusing 100% busy state with the disabled state. Example usage: -- To inject 25% idle time -$ sudo sh -c "echo 25 > /sys/class/thermal/cooling_device80/cur_state -" +- To inject 25% idle time:: + + $ sudo sh -c "echo 25 > /sys/class/thermal/cooling_device80/cur_state If the system is not busy and has more than 25% idle time already, then the powerclamp driver will not start idle injection. Using Top@@ -292,23 +295,23 @@ idle time is accounted as normal idle inthat common code path is taken as the idle task. In this example, 24.1% idle is shown. This helps the system admin or -user determine the cause of slowdown, when a powerclamp driver is in action. +user determine the cause of slowdown, when a powerclamp driver is in action:: -Tasks: 197 total, 1 running, 196 sleeping, 0 stopped, 0 zombie -Cpu(s): 71.2%us, 4.7%sy, 0.0%ni, 24.1%id, 0.0%wa, 0.0%hi, 0.0%si, 0.0%st -Mem: 3943228k total, 1689632k used, 2253596k free, 74960k buffers -Swap: 4087804k total, 0k used, 4087804k free, 945336k cached + Tasks: 197 total, 1 running, 196 sleeping, 0 stopped, 0 zombie + Cpu(s): 71.2%us, 4.7%sy, 0.0%ni, 24.1%id, 0.0%wa, 0.0%hi, 0.0%si, 0.0%st + Mem: 3943228k total, 1689632k used, 2253596k free, 74960k buffers + Swap: 4087804k total, 0k used, 4087804k free, 945336k cached - PID USER PR NI VIRT RES SHR S %CPU %MEM TIME+ COMMAND - 3352 jacob 20 0 262m 644 428 S 286 0.0 0:17.16 spin - 3341 root -51 0 0 0 0 D 25 0.0 0:01.62 kidle_inject/0 - 3344 root -51 0 0 0 0 D 25 0.0 0:01.60 kidle_inject/3 - 3342 root -51 0 0 0 0 D 25 0.0 0:01.61 kidle_inject/1 - 3343 root -51 0 0 0 0 D 25 0.0 0:01.60 kidle_inject/2 - 2935 jacob 20 0 696m 125m 35m S 5 3.3 0:31.11 firefox - 1546 root 20 0 158m 20m 6640 S 3 0.5 0:26.97 Xorg - 2100 jacob 20 0 1223m 88m 30m S 3 2.3 0:23.68 compiz + PID USER PR NI VIRT RES SHR S %CPU %MEM TIME+ COMMAND + 3352 jacob 20 0 262m 644 428 S 286 0.0 0:17.16 spin + 3341 root -51 0 0 0 0 D 25 0.0 0:01.62 kidle_inject/0 + 3344 root -51 0 0 0 0 D 25 0.0 0:01.60 kidle_inject/3 + 3342 root -51 0 0 0 0 D 25 0.0 0:01.61 kidle_inject/1 + 3343 root -51 0 0 0 0 D 25 0.0 0:01.60 kidle_inject/2 + 2935 jacob 20 0 696m 125m 35m S 5 3.3 0:31.11 firefox + 1546 root 20 0 158m 20m 6640 S 3 0.5 0:26.97 Xorg + 2100 jacob 20 0 1223m 88m 30m S 3 2.3 0:23.68 compiz Tests have shown that by using the powerclamp driver as a cooling device, a PID based userspace thermal controller can manage todiff --git a/Documentation/thermal/nouveau_thermalb/Documentation/thermal/nouveau_thermal.rst similarity index 64% rename from Documentation/thermal/nouveau_thermal rename to Documentation/thermal/nouveau_thermal.rst index 6e17a11efcb0..37255fd6735d 100644--- a/Documentation/thermal/nouveau_thermal +++ b/Documentation/thermal/nouveau_thermal.rst@@ -1,13 +1,15 @@ +=====================Kernel driver nouveau -=================== +===================== Supported chips: + * NV43+ Authors: Martin Peres (mupuf) [off-list ref] Description ---------- +----------- This driver allows to read the GPU core temperature, drive the GPU fan and set temperature alarms.@@ -19,20 +21,25 @@ interface is likely not to work. Thisdocument may then not cover your situation entirely. Temperature management --------------------- +---------------------- Temperature is exposed under as a read-only HWMON attribute temp1_input. In order to protect the GPU from overheating, Nouveau supports 4 configurable temperature thresholds: - * Fan_boost: Fan speed is set to 100% when reaching this temperature; - * Downclock: The GPU will be downclocked to reduce its power dissipation; - * Critical: The GPU is put on hold to further lower power dissipation; - * Shutdown: Shut the computer down to protect your GPU. + * Fan_boost: + Fan speed is set to 100% when reaching this temperature; + * Downclock: + The GPU will be downclocked to reduce its power dissipation; + * Critical: + The GPU is put on hold to further lower power dissipation; + * Shutdown: + Shut the computer down to protect your GPU. -WARNING: Some of these thresholds may not be used by Nouveau depending -on your chipset. +WARNING: + Some of these thresholds may not be used by Nouveau depending + on your chipset. The default value for these thresholds comes from the GPU's vbios. These thresholds can be configured thanks to the following HWMON attributes:@@ -46,19 +53,24 @@ NOTE: Remember that the values are stored asmilli degrees Celsius. Don't forget to multiply! Fan management ------------- +-------------- Not all cards have a drivable fan. If you do, then the following HWMON attributes should be available: - * pwm1_enable: Current fan management mode (NONE, MANUAL or AUTO); - * pwm1: Current PWM value (power percentage); - * pwm1_min: The minimum PWM speed allowed; - * pwm1_max: The maximum PWM speed allowed (bypassed when hitting Fan_boost); + * pwm1_enable: + Current fan management mode (NONE, MANUAL or AUTO); + * pwm1: + Current PWM value (power percentage); + * pwm1_min: + The minimum PWM speed allowed; + * pwm1_max: + The maximum PWM speed allowed (bypassed when hitting Fan_boost); You may also have the following attribute: - * fan1_input: Speed in RPM of your fan. + * fan1_input: + Speed in RPM of your fan. Your fan can be driven in different modes:@@ -66,14 +78,16 @@ Your fan can be driven in different modes:* 1: The fan can be driven in manual (use pwm1 to change the speed); * 2; The fan is driven automatically depending on the temperature. -NOTE: Be sure to use the manual mode if you want to drive the fan speed manually +NOTE: + Be sure to use the manual mode if you want to drive the fan speed manually -NOTE2: When operating in manual mode outside the vbios-defined -[PWM_min, PWM_max] range, the reported fan speed (RPM) may not be accurate -depending on your hardware. +NOTE2: + When operating in manual mode outside the vbios-defined + [PWM_min, PWM_max] range, the reported fan speed (RPM) may not be accurate + depending on your hardware. Bug reports ---------- +----------- Thermal management on Nouveau is new and may not work on all cards. If you have inquiries, please ping mupuf on IRC (#nouveau, freenode).diff --git a/Documentation/thermal/power_allocator.txtb/Documentation/thermal/power_allocator.rst similarity index 74% rename from Documentation/thermal/power_allocator.txt rename to Documentation/thermal/power_allocator.rst index 9fb0ff06dca9..67b6a3297238 100644--- a/Documentation/thermal/power_allocator.txt +++ b/Documentation/thermal/power_allocator.rst@@ -1,3 +1,4 @@ +=================================Power allocator governor tunables =================================@@ -25,36 +26,36 @@ temperature as the control input and power asthe controlled output: P_max = k_p * e + k_i * err_integral + k_d * diff_err + sustainable_power where - e = desired_temperature - current_temperature - err_integral is the sum of previous errors - diff_err = e - previous_error + - e = desired_temperature - current_temperature + - err_integral is the sum of previous errors + - diff_err = e - previous_error -It is similar to the one depicted below: +It is similar to the one depicted below:: - k_d - | -current_temp | - | v - | +----------+ +---+ - | +----->| diff_err |-->| X |------+ - | | +----------+ +---+ | - | | | tdp ac tor - | | k_i | | get_r eque sted_power() - | | | | | | | - | | | | | | | ... - v | v v v v v - +---+ | +-------+ +---+ +---+ +---+ +- ---- -----+ - | S |-------+----->| sum e |----->| X |--->| S |-->| S | -->|power | - +---+ | +-------+ +---+ +---+ +--- + |allocation| - ^ | ^ +- ---- -----+ - | | | | | - | | +--- + | | | - | +------->| X |------------------- + v v - | +--- + granted performance -desired_temperature ^ - | - | - k_po/k_pu + k_d + | + current_temp | + | v + | +----------+ +---+ + | +----->| diff_err |-->| X |------+ + | | +----------+ +---+ | + | | | tdp ac tor + | | k_i | | get_r eque sted_power() + | | | | | | | + | | | | | | | ... + v | v v v v v + +---+ | +-------+ +---+ +---+ +---+ +- ---- -----+ + | S |-----+----->| sum e |----->| X |--->| S |-->| S | -->|power | + +---+ | +-------+ +---+ +---+ +--- + |allocation| + ^ | ^ +- ---- -----+ + | | | | | + | | +--- + | | | + | +------->| X |------------------- + v v + | +--- + granted performance + desired_temperature ^ + | + | + k_po/k_pu Sustainable power -----------------@@ -73,7 +74,7 @@ is typically 2000mW, while on a 10" tablet isaround 4500mW (may vary depending on screen size). If you are using device tree, do add it as a property of the -thermal-zone. For example: +thermal-zone. For example:: thermal-zones { soc_thermal {@@ -85,7 +86,7 @@ thermal-zone. For example:Instead, if the thermal zone is registered from the platform code, pass a `thermal_zone_params` that has a `sustainable_power`. If no `thermal_zone_params` were being passed, then something like below -will suffice: +will suffice:: static const struct thermal_zone_params tz_params = { .sustainable_power = 3500,@@ -112,18 +113,18 @@ available capacity at a lowtemperature. On the other hand, a high value of `k_pu` will result in the governor granting very high power while temperature is low, and may lead to temperature overshooting. -The default value for `k_pu` is: +The default value for `k_pu` is:: 2 * sustainable_power / (desired_temperature - switch_on_temp) This means that at `switch_on_temp` the output of the controller's proportional term will be 2 * `sustainable_power`. The default value -for `k_po` is: +for `k_po` is:: sustainable_power / (desired_temperature - switch_on_temp) Focusing on the proportional and feed forward values of the PID -controller equation we have: +controller equation we have:: P_max = k_p * e + sustainable_power@@ -134,21 +135,23 @@ is the desired one, then the proportionalcomponent is zero and thermal equilibrium under constant load. `sustainable_power` is only an estimate, which is the reason for closed-loop control such as this. -Expanding `k_pu` we get: +Expanding `k_pu` we get:: + P_max = 2 * sustainable_power * (T_set - T) / (T_set - T_on) + - sustainable_power + sustainable_power -where - T_set is the desired temperature - T is the current temperature - T_on is the switch on temperature +where: + + - T_set is the desired temperature + - T is the current temperature + - T_on is the switch on temperature When the current temperature is the switch_on temperature, the above -formula becomes: +formula becomes:: P_max = 2 * sustainable_power * (T_set - T_on) / (T_set - T_on) + - sustainable_power = 2 * sustainable_power + sustainable_power = - 3 * sustainable_power + sustainable_power = 2 * sustainable_power + sustainable_power = + 3 * sustainable_power Therefore, the proportional term alone linearly decreases power from 3 * `sustainable_power` to `sustainable_power` as the temperature@@ -178,11 +181,18 @@ Cooling device power APICooling devices controlled by this governor must supply the additional "power" API in their `cooling_device_ops`. It consists on three ops: -1. int get_requested_power(struct thermal_cooling_device *cdev, - struct thermal_zone_device *tz, u32 *power); -@cdev: The `struct thermal_cooling_device` pointer -@tz: thermal zone in which we are currently operating -@power: pointer in which to store the calculated power +1. :: + + int get_requested_power(struct thermal_cooling_device *cdev, + struct thermal_zone_device *tz, u32 *power); + + +@cdev: + The `struct thermal_cooling_device` pointer +@tz: + thermal zone in which we are currently operating +@power: + pointer in which to store the calculated power `get_requested_power()` calculates the power requested by the device in milliwatts and stores it in @power . It should return 0 on@@ -190,23 +200,37 @@ success, -E* on failure. This is currentlyused by the power allocator governor to calculate how much power to give to each cooling device. -2. int state2power(struct thermal_cooling_device *cdev, struct - thermal_zone_device *tz, unsigned long state, u32 *power); -@cdev: The `struct thermal_cooling_device` pointer -@tz: thermal zone in which we are currently operating -@state: A cooling device state -@power: pointer in which to store the equivalent power +2. :: + + int state2power(struct thermal_cooling_device *cdev, struct + thermal_zone_device *tz, unsigned long state, + u32 *power); + +@cdev: + The `struct thermal_cooling_device` pointer +@tz: + thermal zone in which we are currently operating +@state: + A cooling device state +@power: + pointer in which to store the equivalent power Convert cooling device state @state into power consumption in milliwatts and store it in @power. It should return 0 on success, -E* on failure. This is currently used by thermal core to calculate the maximum power that an actor can consume. -3. int power2state(struct thermal_cooling_device *cdev, u32 power, - unsigned long *state); -@cdev: The `struct thermal_cooling_device` pointer -@power: power in milliwatts -@state: pointer in which to store the resulting state +3. :: + + int power2state(struct thermal_cooling_device *cdev, u32 power, + unsigned long *state); + +@cdev: + The `struct thermal_cooling_device` pointer +@power: + power in milliwatts +@state: + pointer in which to store the resulting state Calculate a cooling device state that would make the device consume at most @power mW and store it in @state. It should return 0 on success,diff --git a/Documentation/thermal/sysfs-api.txtb/Documentation/thermal/sysfs-api.rst similarity index 66% rename from Documentation/thermal/sysfs-api.txt rename to Documentation/thermal/sysfs-api.rst index c3fa500df92c..e4930761d3e5 100644--- a/Documentation/thermal/sysfs-api.txt +++ b/Documentation/thermal/sysfs-api.rst@@ -1,3 +1,4 @@ +===================================Generic Thermal Sysfs driver How To ===================================@@ -9,6 +10,7 @@ Copyright (c) 2008 Intel Corporation0. Introduction +=============== The generic thermal sysfs provides a set of interfaces for thermal zone devices (sensors) and thermal cooling devices (fan, processor...) to register@@ -25,59 +27,90 @@ An intelligent thermal management applicationcan make decisions based on inputs from thermal zone attributes (the current temperature and trip point temperature) and throttle appropriate devices. -[0-*] denotes any positive number starting from 0 -[1-*] denotes any positive number starting from 1 +- `[0-*]` denotes any positive number starting from 0 +- `[1-*]` denotes any positive number starting from 1 1. thermal sysfs driver interface functions +=========================================== 1.1 thermal zone device interface -1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *type, - int trips, int mask, void *devdata, - struct thermal_zone_device_ops *ops, - const struct thermal_zone_params *tzp, - int passive_delay, int polling_delay)) +--------------------------------- + + :: + + struct thermal_zone_device + *thermal_zone_device_register(char *type, + int trips, int mask, void *devdata, + struct thermal_zone_device_ops *ops, + const struct thermal_zone_params *tzp, + int passive_delay, int polling_delay)) This interface function adds a new thermal zone device (sensor) to - /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the + /sys/class/thermal folder as `thermal_zone[0-*]`. It tries to bind all the thermal cooling devices registered at the same time. - type: the thermal zone type. - trips: the total number of trip points this thermal zone supports. - mask: Bit string: If 'n'th bit is set, then trip point 'n' is writeable. - devdata: device private data - ops: thermal zone device call-backs. - .bind: bind the thermal zone device with a thermal cooling device. - .unbind: unbind the thermal zone device with a thermal cooling device. - .get_temp: get the current temperature of the thermal zone. - .set_trips: set the trip points window. Whenever the current temperature + type: + the thermal zone type. + trips: + the total number of trip points this thermal zone supports. + mask: + Bit string: If 'n'th bit is set, then trip point 'n' is writeable. + devdata: + device private data + ops: + thermal zone device call-backs. + + .bind: + bind the thermal zone device with a thermal cooling device. + .unbind: + unbind the thermal zone device with a thermal cooling device. + .get_temp: + get the current temperature of the thermal zone. + .set_trips: + set the trip points window. Whenever the current temperature is updated, the trip points immediately below and above the current temperature are found. - .get_mode: get the current mode (enabled/disabled) of the thermal zone. - - "enabled" means the kernel thermal management is enabled. - - "disabled" will prevent kernel thermal driver action upon trip points - so that user applications can take charge of thermal management. - .set_mode: set the mode (enabled/disabled) of the thermal zone. - .get_trip_type: get the type of certain trip point. - .get_trip_temp: get the temperature above which the certain trip point + .get_mode: + get the current mode (enabled/disabled) of the thermal zone. + + - "enabled" means the kernel thermal management is + enabled. + - "disabled" will prevent kernel thermal driver action + upon trip points so that user applications can take + charge of thermal management. + .set_mode: + set the mode (enabled/disabled) of the thermal zone. + .get_trip_type: + get the type of certain trip point. + .get_trip_temp: + get the temperature above which the certain trip point will be fired. - .set_emul_temp: set the emulation temperature which helps in debugging + .set_emul_temp: + set the emulation temperature which helps in debugging different threshold temperature points. - tzp: thermal zone platform parameters. - passive_delay: number of milliseconds to wait between polls when + tzp: + thermal zone platform parameters. + passive_delay: + number of milliseconds to wait between polls when performing passive cooling. - polling_delay: number of milliseconds to wait between polls when checking + polling_delay: + number of milliseconds to wait between polls when checking whether trip points have been crossed (0 for interrupt driven systems). + :: -1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz) + void thermal_zone_device_unregister(struct thermal_zone_device *tz) This interface function removes the thermal zone device. It deletes the corresponding entry from /sys/class/thermal folder and unbinds all the thermal cooling devices it uses. -1.1.3 struct thermal_zone_device *thermal_zone_of_sensor_register( - struct device *dev, int sensor_id, void *data, - const struct thermal_zone_of_device_ops *ops) + :: + + struct thermal_zone_device + *thermal_zone_of_sensor_register(struct device *dev, int sensor_id, + void *data, + const struct thermal_zone_of_device_ops *ops) This interface adds a new sensor to a DT thermal zone. This function will search the list of thermal zones described in@@ -87,25 +120,33 @@ temperature) and throttle appropriatedevices. thermal zone device. The parameters for this interface are: - dev: Device node of sensor containing valid node pointer in + + dev: + Device node of sensor containing valid node pointer in dev->of_node. - sensor_id: a sensor identifier, in case the sensor IP has more + sensor_id: + a sensor identifier, in case the sensor IP has more than one sensors - data: a private pointer (owned by the caller) that will be + data: + a private pointer (owned by the caller) that will be passed back, when a temperature reading is needed. - ops: struct thermal_zone_of_device_ops *. + ops: + `struct thermal_zone_of_device_ops *`. - get_temp: a pointer to a function that reads the + ============== ======================== ==== =========== + get_temp a pointer to a function that reads the sensor temperature. This is mandatory callback provided by sensor driver. - set_trips: a pointer to a function that sets a + set_trips a pointer to a function that sets a temperature window. When this window is left the driver must inform the thermal core via thermal_zone_device_update. - get_trend: a pointer to a function that reads the + get_trend a pointer to a function that reads the sensor temperature trend. - set_emul_temp: a pointer to a function that sets + set_emul_temp a pointer to a function that sets sensor emulated temperature. + ============== ======================== ==== =========== + The thermal zone temperature is provided by the get_temp() function pointer of thermal_zone_of_device_ops. When called, it will have the private pointer @data back.@@ -114,8 +155,10 @@ temperature) and throttle appropriatedevices. handle. Caller should check the return handle with IS_ERR() for finding whether success or not. -1.1.4 void thermal_zone_of_sensor_unregister(struct device *dev, - struct thermal_zone_device *tzd) + :: + + void thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tzd) This interface unregisters a sensor from a DT thermal zone which was successfully added by interface thermal_zone_of_sensor_register().@@ -124,21 +167,29 @@ temperature) and throttle appropriatedevices. interface. It will also silent the zone by remove the .get_temp() and get_trend() thermal zone device callbacks. -1.1.5 struct thermal_zone_device *devm_thermal_zone_of_sensor_register( - struct device *dev, int sensor_id, - void *data, const struct thermal_zone_of_device_ops *ops) + :: + + struct thermal_zone_device + *devm_thermal_zone_of_sensor_register(struct device *dev, + int sensor_id, + void *data, + const struct thermal_zone_of_device_ops *ops) This interface is resource managed version of thermal_zone_of_sensor_register(). + All details of thermal_zone_of_sensor_register() described in section 1.1.3 is applicable here. + The benefit of using this interface to register sensor is that it is not require to explicitly call thermal_zone_of_sensor_unregister() in error path or during driver unbinding as this is done by driver resource manager. -1.1.6 void devm_thermal_zone_of_sensor_unregister(struct device *dev, - struct thermal_zone_device *tzd) + :: + + void devm_thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tzd) This interface is resource managed version of thermal_zone_of_sensor_unregister().@@ -147,123 +198,186 @@ temperature) and throttle appropriatedevices. Normally this function will not need to be called and the resource management code will ensure that the resource is freed. -1.1.7 int thermal_zone_get_slope(struct thermal_zone_device *tz) + :: + + int thermal_zone_get_slope(struct thermal_zone_device *tz) This interface is used to read the slope attribute value for the thermal zone device, which might be useful for platform drivers for temperature calculations. -1.1.8 int thermal_zone_get_offset(struct thermal_zone_device *tz) + :: + + int thermal_zone_get_offset(struct thermal_zone_device *tz) This interface is used to read the offset attribute value for the thermal zone device, which might be useful for platform drivers for temperature calculations. 1.2 thermal cooling device interface -1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, - void *devdata, struct thermal_cooling_device_ops *) +------------------------------------ + + + :: + + struct thermal_cooling_device + *thermal_cooling_device_register(char *name, + void *devdata, struct thermal_cooling_device_ops *) This interface function adds a new thermal cooling device (fan/processor/...) - to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself + to /sys/class/thermal/ folder as `cooling_device[0-*]`. It tries to bind itself to all the thermal zone devices registered at the same time. - name: the cooling device name. - devdata: device private data. - ops: thermal cooling devices call-backs. - .get_max_state: get the Maximum throttle state of the cooling device. - .get_cur_state: get the Currently requested throttle state of the cooling device. - .set_cur_state: set the Current throttle state of the cooling device. - -1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) + + name: + the cooling device name. + devdata: + device private data. + ops: + thermal cooling devices call-backs. + + .get_max_state: + get the Maximum throttle state of the cooling device. + .get_cur_state: + get the Currently requested throttle state of the + cooling device. + .set_cur_state: + set the Current throttle state of the cooling device. + + :: + + void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) This interface function removes the thermal cooling device. It deletes the corresponding entry from /sys/class/thermal folder and unbinds itself from all the thermal zone devices using it. 1.3 interface for binding a thermal zone device with a thermal cooling device -1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, - int trip, struct thermal_cooling_device *cdev, - unsigned long upper, unsigned long lower, unsigned int weight); +-------------------------------------------------------------- ---- ----------- + + :: + + int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, + int trip, struct thermal_cooling_device *cdev, + unsigned long upper, unsigned long lower, unsigned int weight); This interface function binds a thermal cooling device to a particular trip point of a thermal zone device. + This function is usually called in the thermal zone device .bind callback. - tz: the thermal zone device - cdev: thermal cooling device - trip: indicates which trip point in this thermal zone the cooling device - is associated with. - upper:the Maximum cooling state for this trip point. - THERMAL_NO_LIMIT means no upper limit, + + tz: + the thermal zone device + cdev: + thermal cooling device + trip: + indicates which trip point in this thermal zone the cooling device + is associated with. + upper: + the Maximum cooling state for this trip point. + THERMAL_NO_LIMIT means no upper limit, and the cooling device can be in max_state. - lower:the Minimum cooling state can be used for this trip point. - THERMAL_NO_LIMIT means no lower limit, + lower: + the Minimum cooling state can be used for this trip point. + THERMAL_NO_LIMIT means no lower limit, and the cooling device can be in cooling state 0. - weight: the influence of this cooling device in this thermal - zone. See 1.4.1 below for more information. + weight: + the influence of this cooling device in this thermal + zone. See 1.4.1 below for more information. -1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, - int trip, struct thermal_cooling_device *cdev); + :: + + int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, + int trip, struct thermal_cooling_device *cdev); This interface function unbinds a thermal cooling device from a particular trip point of a thermal zone device. This function is usually called in the thermal zone device .unbind callback. - tz: the thermal zone device - cdev: thermal cooling device - trip: indicates which trip point in this thermal zone the cooling device - is associated with. + + tz: + the thermal zone device + cdev: + thermal cooling device + trip: + indicates which trip point in this thermal zone the cooling device + is associated with. 1.4 Thermal Zone Parameters -1.4.1 struct thermal_bind_params +--------------------------- + + :: + + struct thermal_bind_params + This structure defines the following parameters that are used to bind a zone with a cooling device for a particular trip point. - .cdev: The cooling device pointer - .weight: The 'influence' of a particular cooling device on this - zone. This is relative to the rest of the cooling - devices. For example, if all cooling devices have a - weight of 1, then they all contribute the same. You can - use percentages if you want, but it's not mandatory. A - weight of 0 means that this cooling device doesn't - contribute to the cooling of this zone unless all cooling - devices have a weight of 0. If all weights are 0, then - they all contribute the same. - .trip_mask:This is a bit mask that gives the binding relation between - this thermal zone and cdev, for a particular trip point. - If nth bit is set, then the cdev and thermal zone are bound - for trip point n. - .binding_limits: This is an array of cooling state limits. Must have - exactly 2 * thermal_zone.number_of_trip_points. It is an - array consisting of tuples <lower-state upper- state> of - state limits. Each trip will be associated with one state - limit tuple when binding. A NULL pointer means - <THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips. - These limits are used when binding a cdev to a trip point. - .match: This call back returns success(0) if the 'tz and cdev' need to + + .cdev: + The cooling device pointer + .weight: + The 'influence' of a particular cooling device on this + zone. This is relative to the rest of the cooling + devices. For example, if all cooling devices have a + weight of 1, then they all contribute the same. You can + use percentages if you want, but it's not mandatory. A + weight of 0 means that this cooling device doesn't + contribute to the cooling of this zone unless all cooling + devices have a weight of 0. If all weights are 0, then + they all contribute the same. + .trip_mask: + This is a bit mask that gives the binding relation between + this thermal zone and cdev, for a particular trip point. + If nth bit is set, then the cdev and thermal zone are bound + for trip point n. + .binding_limits: + This is an array of cooling state limits. Must have + exactly 2 * thermal_zone.number_of_trip_points. It is an + array consisting of tuples <lower-state upper- state> of + state limits. Each trip will be associated with one state + limit tuple when binding. A NULL pointer means + <THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips. + These limits are used when binding a cdev to a trip point. + .match: + This call back returns success(0) if the 'tz and cdev' need to be bound, as per platform data. -1.4.2 struct thermal_zone_params + + :: + + struct thermal_zone_params + This structure defines the platform level parameters for a thermal zone. This data, for each thermal zone should come from the platform layer. This is an optional feature where some platforms can choose not to provide this data. - .governor_name: Name of the thermal governor used for this zone - .no_hwmon: a boolean to indicate if the thermal to hwmon sysfs interface - is required. when no_hwmon == false, a hwmon sysfs interface - will be created. when no_hwmon == true, nothing will be done. - In case the thermal_zone_params is NULL, the hwmon interface - will be created (for backward compatibility). - .num_tbps: Number of thermal_bind_params entries for this zone - .tbp: thermal_bind_params entries + + .governor_name: + Name of the thermal governor used for this zone + .no_hwmon: + a boolean to indicate if the thermal to hwmon sysfs interface + is required. when no_hwmon == false, a hwmon sysfs interface + will be created. when no_hwmon == true, nothing will be done. + In case the thermal_zone_params is NULL, the hwmon interface + will be created (for backward compatibility). + .num_tbps: + Number of thermal_bind_params entries for this zone + .tbp: + thermal_bind_params entries 2. sysfs attributes structure +============================= +== ================ RO read only value WO write only value RW read/write value +== ================ Thermal sysfs attributes will be represented under /sys/class/thermal. Hwmon sysfs I/F extension is also available under /sys/class/hwmon if hwmon is compiled in or built as a module. -Thermal zone device sys I/F, created once it's registered: -/sys/class/thermal/thermal_zone[0-*]: +Thermal zone device sys I/F, created once it's registered:: + + /sys/class/thermal/thermal_zone[0-*]: |---type: Type of the thermal zone |---temp: Current temperature |---mode: Working mode of the thermal zone@@ -282,8 +396,9 @@ Thermal zone device sys I/F, created onceit's registered: |---slope: Slope constant applied as linear extrapolation |---offset: Offset constant applied as linear extrapolation -Thermal cooling device sys I/F, created once it's registered: -/sys/class/thermal/cooling_device[0-*]: +Thermal cooling device sys I/F, created once it's registered:: + + /sys/class/thermal/cooling_device[0-*]: |---type: Type of the cooling device(processor/fan/...) |---max_state: Maximum cooling state of the cooling device |---cur_state: Current cooling state of the cooling device@@ -299,11 +414,13 @@ the relationship between a thermal zone andits associated cooling device. They are created/removed for each successful execution of thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_dev ice. -/sys/class/thermal/thermal_zone[0-*]: +:: + + /sys/class/thermal/thermal_zone[0-*]: |---cdev[0-*]: [0-*]th cooling device in current thermal zone |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with |---cdev[0-*]_weight: Influence of the cooling device in - this thermal zone + this thermal zone Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, the generic thermal driver also creates a hwmon sysfs I/F for each _type_@@ -311,16 +428,17 @@ of thermal zone device. E.g. the genericthermal driver registers one hwmon class device and build the associated hwmon sysfs I/F for all the registered ACPI thermal zones. -/sys/class/hwmon/hwmon[0-*]: +:: + + /sys/class/hwmon/hwmon[0-*]: |---name: The type of the thermal zone devices |---temp[1-*]_input: The current temperature of thermal zone [1-*] |---temp[1-*]_critical: The critical trip point of thermal zone [1-*] Please read Documentation/hwmon/sysfs-interface.rst for additional information. -*************************** -* Thermal zone attributes * -*************************** +Thermal zone attributes +----------------------- type Strings which represent the thermal zone type.@@ -340,54 +458,67 @@ modeThis file gives information about the algorithm that is currently managing the thermal zone. It can be either default kernel based algorithm or user space application. - enabled = enable Kernel Thermal management. - disabled = Preventing kernel thermal zone driver actions upon + + enabled + enable Kernel Thermal management. + disabled + Preventing kernel thermal zone driver actions upon trip points so that user application can take full charge of the thermal management. + RW, Optional policy One of the various thermal governors used for a particular zone. + RW, Required available_policies Available thermal governors which can be used for a particular zone. + RO, Required -trip_point_[0-*]_temp +`trip_point_[0-*]_temp` The temperature above which trip point will be fired. + Unit: millidegree Celsius + RO, Optional -trip_point_[0-*]_type +`trip_point_[0-*]_type` Strings which indicate the type of the trip point. - E.g. it can be one of critical, hot, passive, active[0- *] for ACPI + + E.g. it can be one of critical, hot, passive, `active[0- *]` for ACPI thermal zone. + RO, Optional -trip_point_[0-*]_hyst +`trip_point_[0-*]_hyst` The hysteresis value for a trip point, represented as an integer Unit: Celsius RW, Optional -cdev[0-*] +`cdev[0-*]` Sysfs link to the thermal cooling device node where the sys I/F for cooling device throttling control represents. + RO, Optional -cdev[0-*]_trip_point - The trip point in this thermal zone which cdev[0-*] is associated +`cdev[0-*]_trip_point` + The trip point in this thermal zone which `cdev[0-*]` is associated with; -1 means the cooling device is not associated with any trip point. + RO, Optional -cdev[0-*]_weight - The influence of cdev[0-*] in this thermal zone. This value - is relative to the rest of cooling devices in the thermal - zone. For example, if a cooling device has a weight double - than that of other, it's twice as effective in cooling the - thermal zone. - RW, Optional +`cdev[0-*]_weight` + The influence of `cdev[0-*]` in this thermal zone. This value + is relative to the rest of cooling devices in the thermal + zone. For example, if a cooling device has a weight double + than that of other, it's twice as effective in cooling the + thermal zone. + + RW, Optional passive Attribute is only present for zones in which the passive cooling@@ -395,8 +526,11 @@ passiveand can be set to a temperature (in millidegrees) to enable a passive trip point for the zone. Activation is done by polling with an interval of 1 second. + Unit: millidegrees Celsius + Valid values: 0 (disabled) or greater than 1000 + RW, Optional emul_temp@@ -407,17 +541,21 @@ emul_tempthreshold and its associated cooling action. This is write only node and writing 0 on this node should disable emulation. Unit: millidegree Celsius + WO, Optional - WARNING: Be careful while enabling this option on production systems, - because userland can easily disable the thermal policy by simply - flooding this sysfs node with low temperature values. + WARNING: + Be careful while enabling this option on production systems, + because userland can easily disable the thermal policy by simply + flooding this sysfs node with low temperature values. sustainable_power An estimate of the sustained power that can be dissipated by the thermal zone. Used by the power allocator governor. For - more information see Documentation/thermal/power_allocator.txt + more information see Documentation/thermal/power_allocator.rst + Unit: milliwatts + RW, Optional k_po@@ -425,7 +563,8 @@ k_pocontroller during temperature overshoot. Temperature overshoot is when the current temperature is above the "desired temperature" trip point. For more information see - Documentation/thermal/power_allocator.txt + Documentation/thermal/power_allocator.rst + RW, Optional k_pu@@ -433,20 +572,23 @@ k_pucontroller during temperature undershoot. Temperature undershoot is when the current temperature is below the "desired temperature" trip point. For more information see - Documentation/thermal/power_allocator.txt + Documentation/thermal/power_allocator.rst + RW, Optional k_i The integral term of the power allocator governor's PID controller. This term allows the PID controller to compensate for long term drift. For more information see - Documentation/thermal/power_allocator.txt + Documentation/thermal/power_allocator.rst + RW, Optional k_d The derivative term of the power allocator governor's PID controller. For more information see - Documentation/thermal/power_allocator.txt + Documentation/thermal/power_allocator.rst + RW, Optional integral_cutoff@@ -456,8 +598,10 @@ integral_cutoffexample, if integral_cutoff is 0, then the integral term only accumulates error when temperature is above the desired temperature trip point. For more information see - Documentation/thermal/power_allocator.txt + Documentation/thermal/power_allocator.rst + Unit: millidegree Celsius + RW, Optional slope@@ -465,6 +609,7 @@ slopeto determine a hotspot temperature based off the sensor's raw readings. It is up to the device driver to determine the usage of these values. + RW, Optional offset@@ -472,28 +617,33 @@ offsetto determine a hotspot temperature based off the sensor's raw readings. It is up to the device driver to determine the usage of these values. + RW, Optional -***************************** -* Cooling device attributes * -***************************** +Cooling device attributes +------------------------- type String which represents the type of device, e.g: + - for generic ACPI: should be "Fan", "Processor" or "LCD" - for memory controller device on intel_menlow platform: should be "Memory controller". + RO, Required max_state The maximum permissible cooling state of this cooling device. + RO, Required cur_state The current cooling state of this cooling device. The value can any integer numbers between 0 and max_state: + - cur_state == 0 means no cooling - cur_state == max_state means the maximum cooling. + RW, Required stats/reset@@ -508,9 +658,11 @@ stats/time_in_state_ms:units here is 10mS (similar to other time exported in /proc). RO, Required + stats/total_trans: A single positive value showing the total number of times the state of a cooling device is changed. + RO, Required stats/trans_table:@@ -522,6 +674,7 @@ stats/trans_table:RO, Required 3. A simple implementation +========================== ACPI thermal zone may support multiple trip points like critical, hot, passive, active. If an ACPI thermal zone supports critical, passive,@@ -532,11 +685,10 @@ thermal_cooling_device. Both are consideredto have the same effectiveness in cooling the thermal zone. If the processor is listed in _PSL method, and the fan is listed in _AL0 -method, the sys I/F structure will be built like this: +method, the sys I/F structure will be built like this:: -/sys/class/thermal: - -|thermal_zone1: + /sys/class/thermal: + |thermal_zone1: |---type: acpitz |---temp: 37000 |---mode: enabled@@ -557,24 +709,24 @@ method, the sys I/F structure will be builtlike this: |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ |---cdev1_weight: 1024 -|cooling_device0: + |cooling_device0: |---type: Processor |---max_state: 8 |---cur_state: 0 -|cooling_device3: + |cooling_device3: |---type: Fan |---max_state: 2 |---cur_state: 0 -/sys/class/hwmon: - -|hwmon0: + /sys/class/hwmon: + |hwmon0: |---name: acpitz |---temp1_input: 37000 |---temp1_crit: 100000 4. Event Notification +===================== The framework includes a simple notification mechanism, in the form of a netlink event. Netlink socket initialization is done during the _init_@@ -587,21 +739,28 @@ event will be one of:{THERMAL_AUX0,THERMAL_AUX1, THERMAL_CRITICAL, THERMAL_DEV_FAULT}. Notification can be sent when the current temperature crosses any of the configured thresholds. -5. Export Symbol APIs: +5. Export Symbol APIs +===================== + +5.1. get_tz_trend +----------------- -5.1: get_tz_trend: This function returns the trend of a thermal zone, i.e the rate of change of temperature of the thermal zone. Ideally, the thermal sensor drivers are supposed to implement the callback. If they don't, the thermal framework calculated the trend by comparing the previous and the current temperature values. -5.2:get_thermal_instance: +5.2. get_thermal_instance +------------------------- + This function returns the thermal_instance corresponding to a given {thermal_zone, cooling_device, trip_point} combination. Returns NULL if such an instance does not exist. -5.3:thermal_notify_framework: +5.3. thermal_notify_framework +----------------------------- + This function handles the trip events from sensor drivers. It starts throttling the cooling devices according to the policy configured. For CRITICAL and HOT trip points, this notifies the respective drivers,@@ -609,12 +768,15 @@ and does actual throttling for other trippoints i.e ACTIVE and PASSIVE. The throttling policy is based on the configured platform data; if no platform data is provided, this uses the step_wise throttling policy. -5.4:thermal_cdev_update: +5.4. thermal_cdev_update +------------------------ + This function serves as an arbitrator to set the state of a cooling device. It sets the cooling device to the deepest cooling state if possible. -6. thermal_emergency_poweroff: +6. thermal_emergency_poweroff +============================= On an event of critical trip temperature crossing. Thermal framework allows the system to shutdown gracefully by calling orderly_poweroff().diff --git a/Documentation/thermal/x86_pkg_temperature_thermalb/Documentation/thermal/x86_pkg_temperature_thermal.rst similarity index 80% rename from Documentation/thermal/x86_pkg_temperature_thermal rename to Documentation/thermal/x86_pkg_temperature_thermal.rst index 17a3a4c0a0ca..f134dbd3f5a9 100644--- a/Documentation/thermal/x86_pkg_temperature_thermal +++ b/Documentation/thermal/x86_pkg_temperature_thermal.rst@@ -1,19 +1,23 @@ +===================================Kernel driver: x86_pkg_temp_thermal -=================== +=================================== Supported chips: + * x86: with package level thermal management + (Verify using: CPUID.06H:EAX[bit 6] =1) Authors: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.co m> Reference ---- +--------- + Intel® 64 and IA-32 Architectures Software Developer’s Manual (Jan, 2013): Chapter 14.6: PACKAGE LEVEL THERMAL MANAGEMENT Description ---------- +----------- This driver register CPU digital temperature package level sensor as a thermal zone with maximum two user mode configurable trip points. Number of trip points@@ -25,23 +29,27 @@ take any action to control temperature.Threshold management -------------------- Each package will register as a thermal zone under /sys/class/thermal. -Example: -/sys/class/thermal/thermal_zone1 + +Example:: + + /sys/class/thermal/thermal_zone1 This contains two trip points: + - trip_point_0_temp - trip_point_1_temp User can set any temperature between 0 to TJ-Max temperature. Temperature units -are in milli-degree Celsius. Refer to "Documentation/thermal/sysfs- api.txt" for +are in milli-degree Celsius. Refer to "Documentation/thermal/sysfs- api.rst" for thermal sys-fs details. Any value other than 0 in these trip points, can trigger thermal notifications. Setting 0, stops sending thermal notifications. -Thermal notifications: To get kobject-uevent notifications, set the thermal zone -policy to "user_space". For example: echo -n "user_space" > policy - - +Thermal notifications: +To get kobject-uevent notifications, set the thermal zone +policy to "user_space". +For example:: + echo -n "user_space" > policydiff --git a/MAINTAINERS b/MAINTAINERS index d9e214f68e52..b2254bc8e495 100644 --- a/MAINTAINERS +++ b/MAINTAINERS@@ -15687,7 +15687,7 @@ M: Viresh Kumar <viresh.kumar@linaro.o rg> M: Javi Merino [off-list ref] L: linux-pm@vger.kernel.org S: Supported -F: Documentation/thermal/cpu-cooling-api.txt +F: Documentation/thermal/cpu-cooling-api.rst F: drivers/thermal/cpu_cooling.c F: include/linux/cpu_cooling.hdiff --git a/include/linux/thermal.h b/include/linux/thermal.h index 15a4ca5d7099..681047f8cc05 100644 --- a/include/linux/thermal.h +++ b/include/linux/thermal.h@@ -251,7 +251,7 @@ struct thermal_bind_params {* platform characterization. This value is relative to the * rest of the weights so a cooling device whose weight is * double that of another cooling device is twice as - * effective. See Documentation/thermal/sysfs-api.txt for more + * effective. See Documentation/thermal/sysfs-api.rst for more * information. */ int weight;@@ -259,7 +259,7 @@ struct thermal_bind_params {/* * This is a bit mask that gives the binding relation between this * thermal zone and cdev, for a particular trip point. - * See Documentation/thermal/sysfs-api.txt for more information. + * See Documentation/thermal/sysfs-api.rst for more information. */ int trip_mask;Thanks, Mauro
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