[PATCH 06/15] arm: dts: sun: Add missing cooling device properties for CPUs
From: Maxime Ripard <hidden>
Date: 2018-06-01 15:17:15
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linux-devicetree, lkml
Hi, On Mon, May 28, 2018 at 04:27:34PM +0530, Viresh Kumar wrote:
On 28-05-18, 10:44, Maxime Ripard wrote:quoted
Hi, On Fri, May 25, 2018 at 04:01:52PM +0530, Viresh Kumar wrote:quoted
The cooling device properties, like "#cooling-cells" and "dynamic-power-coefficient", should either be present for all the CPUs of a cluster or none. If these are present only for a subset of CPUs of a cluster then things will start falling apart as soon as the CPUs are brought online in a different order. For example, this will happen because the operating system looks for such properties in the CPU node it is trying to bring up, so that it can register a cooling device. Add such missing properties. Fix other missing properties (clocks, OPP, clock latency) as well to make it all work. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>The prefix should be sunxi and not sun, but it looks good to me otherwise. Let me know what your preferred merge method is.Please pick it up directly and send it as part of your pull request. Do you want me to resend or can you fix the $subject ?
I just tried to apply it, and it failed. We have usually two different PR for the H3 SoCs and the others. Could you split the H3 in a separate patch (and fix the subject in the process?) Thanks! Maxime -- Maxime Ripard, Bootlin (formerly Free Electrons) Embedded Linux and Kernel engineering https://bootlin.com -------------- next part -------------- A non-text attachment was scrubbed... Name: signature.asc Type: application/pgp-signature Size: 833 bytes Desc: not available URL: <http://lists.infradead.org/pipermail/linux-arm-kernel/attachments/20180601/68b1a4e3/attachment.sig>