[PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings
From: Daniel Lezcano <hidden>
Date: 2017-09-04 10:36:32
Also in:
linux-devicetree, linux-pm, lkml
On 04/09/2017 08:39, Wangtao (Kevin, Kirin) wrote:
? 2017/9/1 2:24, Daniel Lezcano ??:quoted
On 29/08/2017 10:17, Tao Wang wrote:quoted
From: Tao Wang <redacted> This adds documentation of device tree bindings for the thermal sensor controller of hi3660 SoC. Signed-off-by: Tao Wang <redacted> --- .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++ 1 file changed, 37 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt new file mode 100644 index 0000000..4643dbe--- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt@@ -0,0 +1,37 @@ +* Temperature Sensor on hisilicon SoC + +Hisilicon SoC supplies temperature sensor feature, each CPU clusterand G3D +area contains a temperture sensor. The temperture sensor produces an output +value which has a linear relationship with the temperture of the area. +s/temperture/temperature/THXquoted
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+for Hi3660, +sensor0 monitors the temperture of A53; +sensor1 monitors the temperture of A72; +sensor2 monitors the temperture of GPU; +sensor3 is a virtual sensor, which produces the maximum value of all sensors; +sensor4 is a virtual sensor, which produces the average value of all sensors.I don't think we need to escribe the virtual sensors in the DT bindings.I just want to let user know the sensor id of virtual sensor, I also define it in header file, so the header file is enough?
The virtual sensor (or something else) should be a separate, generic thing to be used for anyone.
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+** Required properties : +- compatible: "hisilicon,thermal-tsensor". +- reg: physical reg address of thermal sensor and length of memory mapped + region. +- hisi,tsensors: number of hardware tsensors +- hisi,coef: An array of integers (one signed cell) containing + coefficients to turn adc value to temperture. +- hisi,adc-range: adc value range, minimum value is followed by maximum value. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : +Hi3660: +tsensor: tsensor at fff30000 { + compatible = "hisilicon,hi3660-tsensor"; + #address-cells = <2>; + #size-cells = <2>; + reg = <0x0 0xfff3001c 0x0 0x4>, + <0x0 0xfff3005c 0x0 0x4>, + <0x0 0xfff3009c 0x0 0x4>; + hisi,tsensors = <HISI_MAX_TSENSORS>; + hisi,coef = <165000 (-40000)>; + hisi,adc-range = <0x74 0x39A>;Do we really need max sensors, coef and adc range to be specified in the DT? Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the coef, adc, in the driver itself?My purpose is to make the driver be compitable with our future platform.
I don't see the point. The compatibility could be handled in the driver itself, no? -- <http://www.linaro.org/> Linaro.org ? Open source software for ARM SoCs Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | <http://twitter.com/#!/linaroorg> Twitter | <http://www.linaro.org/linaro-blog/> Blog