Thread (37 messages) 37 messages, 6 authors, 2017-09-05

[PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

From: Daniel Lezcano <hidden>
Date: 2017-09-04 10:36:32
Also in: linux-devicetree, linux-pm, lkml

On 04/09/2017 08:39, Wangtao (Kevin, Kirin) wrote:

? 2017/9/1 2:24, Daniel Lezcano ??:
quoted
On 29/08/2017 10:17, Tao Wang wrote:
quoted
From: Tao Wang <redacted>

This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.

Signed-off-by: Tao Wang <redacted>
---
  .../devicetree/bindings/thermal/hisi-tsensor.txt   | 37
++++++++++++++++++++++
  1 file changed, 37 insertions(+)
  create mode 100644
Documentation/devicetree/bindings/thermal/hisi-tsensor.txt

diff --git
a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
new file mode 100644
index 0000000..4643dbe
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
@@ -0,0 +1,37 @@
+* Temperature Sensor on hisilicon SoC
+
+Hisilicon SoC supplies temperature sensor feature, each CPU cluster
and G3D
+area contains a temperture sensor. The temperture sensor produces an
output
+value which has a linear relationship with the temperture of the area.
+
s/temperture/temperature/
THX
quoted
quoted
+for Hi3660,
+sensor0 monitors the temperture of A53;
+sensor1 monitors the temperture of A72;
+sensor2 monitors the temperture of GPU;
+sensor3 is a virtual sensor, which produces the maximum value of all
sensors;
+sensor4 is a virtual sensor, which produces the average value of all
sensors.
I don't think we need to escribe the virtual sensors in the DT bindings.
I just want to let user know the sensor id of virtual sensor, I also
define it in header file, so the header file is enough?
The virtual sensor (or something else) should be a separate, generic
thing to be used for anyone.
quoted
quoted
+** Required properties :
+- compatible: "hisilicon,thermal-tsensor".
+- reg: physical reg address of thermal sensor and length of memory
mapped
+  region.
+- hisi,tsensors: number of hardware tsensors
+- hisi,coef:    An array of integers (one signed cell) containing
+        coefficients to turn adc value to temperture.
+- hisi,adc-range: adc value range, minimum value is followed by
maximum value.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a
description.
+
+Example :
+Hi3660:
+tsensor: tsensor at fff30000 {
+    compatible = "hisilicon,hi3660-tsensor";
+    #address-cells = <2>;
+    #size-cells = <2>;
+    reg = <0x0 0xfff3001c 0x0 0x4>,
+        <0x0 0xfff3005c 0x0 0x4>,
+        <0x0 0xfff3009c 0x0 0x4>;
+    hisi,tsensors = <HISI_MAX_TSENSORS>;
+    hisi,coef = <165000 (-40000)>;
+    hisi,adc-range = <0x74 0x39A>;
Do we really need max sensors, coef and adc range to be specified in
the DT?

Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the
coef, adc, in the driver itself?
My purpose is to make the driver be compitable with our future platform.
I don't see the point. The compatibility could be handled in the driver
itself, no?


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